Intel Xeon Processor Ec5549 And Ec5509 Thermal Profile; Processor Ec5549 And Ec5509 Thermal Specifications - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

The Intel
all support Thermal Profiles with nominal and short-term conditions designed to meet
NEBS Level 3 compliance. See specifications below. For these SKUs, operation at either
the nominal or short-term thermal profiles should result in virtually no TCC activation.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP), instead of
the maximum processor power consumption. The Adaptive Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, see
Section 6.2. The Adaptive Thermal Monitor feature must be enabled for the
processor to remain within its specifications.
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Table 6-1. Intel Xeon
Core
Frequency
Launch to FMB
Notes:
1. These values are specified at V
the processor is not to be subjected to any static V
specified ICC. See the loadline specifications in the Datasheet.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
3. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
4. Power specifications are defined at all VIDs found in the Datasheet. The Intel
C3500 series may be shipped under multiple VIDs for each frequency.
5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency
requirements.
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Figure 6-1. Intel Xeon
Notes:
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1. Intel
unconstrained platform. See
2. Implementation of Intel
TCC activation.
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Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
37
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Xeon processor LC5500 and LC3500 series (60 W, 48 W, 35 W, and 23 W)
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Processor EC5549 and EC5509 Thermal Specifications

Thermal Design
Power
(W)
85
CC_MAX
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Processor EC5549 and EC5509 Thermal Profile
80
70
60
50
40
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
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Xeon processor EC5549 and EC5509 Thermal Profile is representative of a volumetrically
Table 6-2
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Xeon processor EC5549 and EC5509 Thermal Profile should result in virtually no
Minimum Maximum
T T
CASE CASE
(°C) (°C)
5 See Figure 6-1;
for all processor frequencies. Systems must be designed to ensure
and I combination wherein V
CC CC
Thermal Profile
Thermal Profile
Tc = 0.303* P + 51.8
Power [W]
for discrete points that constitute the thermal profile.
Thermal Specifications
Notes
Table 6-2 1, 2, 3, 4, 5
exceeds V
CC CC_MAX
.
CASE
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Xeon processor C5500/
August 2010
Order Number: 323107-002US
at