Related Manuals for Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray
Summary of Contents for Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray
- Page 1 ® Intel Core 2 Duo E6400, E4300, ® ® and Intel Pentium Dual-Core E2160 Processor Thermal Design Guide October 2007 Order Number: 315279 - 003US...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548- 4725, or by visiting Intel’s Web...
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Page 3: Table Of Contents
® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor Contents Introduction ......................7 Document Goals and Scope .................. 7 1.1.1 Importance of Thermal Management............7 1.1.2 Document Goals..................7 1.1.3 Document Scope ..................7 References ...................... - Page 4 Fan Hub Thermistor and Intel QST ..............43 LGA775 Socket Heatsink Loading ................44 LGA775 Socket Heatsink Considerations ...............44 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design ..44 Heatsink Selection Guidelines ................49 Thermal Interface Management ................50 Bond Line Management ..................50 Interface Material Area ..................50...
- Page 5 Tables Referenced Documents ....................9 Terms Used....................... 9 Thermal Characterization Parameter at various T 's............. 33 Board Deflection Configuration Definitions ..............45 Intel Reference Component PICMG 1.3 Thermal Solution Providers ......... 56 ® ® ® Intel Core 2 Duo E6400, E4300, and Intel...
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Page 6: Revision History
2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor— Revision History Date Revision Description October 2007 Updated to include the Intel® Pentium® Dual-Core E2160 processor March 2007 Updated to include the Intel® E4300 processor September 2006 Initial release ® ® ®... -
Page 7: Introduction
The concepts given in this document are applicable to any system form factor. Specific examples used will be the Intel enabled reference solution for PICMG 1.3 server systems. Please refer to the applicable ATX and BTX form factor reference documents and thermal design guidelines to design a thermal solution for those form factors. - Page 8 • Intel® Pentium® Dual-Core E2160 Processor for Embedded Applications In this document, when a reference is made to "the datasheet", the reader should refer to the Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Sequences Datasheet and Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet.
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Page 9: References
Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor http://www.intel.com/design/ Thermal and Mechanical Design Guidelines processor/designex/317804.htm http://developer.intel.com/ Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA design/Pentium4/guides/ Package Thermal and Mechanical Design Guidelines 302553.htm Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/... - Page 10 ® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor— Introduction Table 2. Terms Used (Sheet 2 of 2) Term Description Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (T ) / Total Package Power.
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Page 11: Processor Thermal/Mechanical Information
® ® Processor Thermal/Mechanical Information—Intel Core 2 Duo E6400, E4300, and Intel ® Pentium Dual-Core E2160 Processor Processor Thermal/Mechanical Information Mechanical Requirements 2.1.1 Processor Package The processor is packaged in a 775-Land LGA package that interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. -
Page 12: Heatsink Attach
® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor—Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). -
Page 13: Heatsink Clip Load Requirement
For additional guidelines on mechanical design, in particular on designs departing from the reference design assumptions, refer to Appendix For information on Clip loading, refer to the Intel® Core™2 Duo Desktop Processor E6000? Sequence Thermal and Mechanical Design Guidelines Supporting the Intel® Core™2 Duo desktop processor E6000 Sequence. -
Page 14: Thermal Requirements
® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor—Processor Thermal/Mechanical Information — The height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor datasheet. -
Page 15: Thermal Profile
15% over the previous Intel reference design, less than the Intel RCBFH-3 reference design and about 28% less than the BTX Type II reference design. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines, available on www.intel.com... -
Page 16: Control
This is achieved in part by using the Ψ vs. RPM and RPM versus acoustics (dBA) performance curves from the Intel enabled thermal solution. A thermal solution designed to meet the thermal profile should have similar... -
Page 17: Heatsink Design Considerations
® Pentium Dual-Core E2160 Processor Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for details on implementing a design using T and the Thermal Profile. CONTROL Heatsink Design Considerations To remove the heat from the processor, three basic parameters should be considered: •... -
Page 18: Heatsink Mass
The package IHS flatness for the product is specified in the datasheet and can be used as a baseline to predict heatsink performance during the design phase. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact of IHS flatness change due to combined socket and heatsink loading. -
Page 19: System Thermal Solution Considerations
System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that the chassis delivers a maximum TA of 38-40°C with 15-25 CFM of airflow at the inlet of the processor heatsink. -
Page 20: System Integration Considerations
Socket documentation provides Best Known Methods for all aspects of LGA775 socket based platforms and systems manufacturing. Of particular interest for package and heatsink installation and removal is the System Assembly module. A video covering system integration is also available. Contact your Intel field sales representative for more information. ®... -
Page 21: Thermal Metrology
® ® ® Thermal Metrology—Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor Thermal Metrology This section discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the "thermal characterization parameter", Ψ... -
Page 22: Example
The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for illustration purposes only. Assume the TDP, as listed in the datasheet, is 100 W and the maximum case temperature from the thermal profile for 100 W is 67°... -
Page 23: Processor Thermal Solution Performance Assessment
Processor Thermal Solution Performance Assessment Thermal performance of a heatsink should be assessed using a thermal test vehicle (TTV) provided by Intel. The TTV is a stable heat source for making accurate power measurements, whereas processors can introduce additional factors that can impact test results. -
Page 24: Locations For Measuring Local Ambient Temperature, Active Heatsink
® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor—Thermal Metrology half way between the fan hub and the fan housing. If a variable speed fan is used, it may be useful to add a thermocouple taped to the barrier above the location of the temperature sensor used by the fan to check its speed setting against air temperature. -
Page 25: Processor Case Temperature Measurement Guidelines
® ® ® Thermal Metrology—Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink Note: Drawing Not to Scale Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when T is maintained at or below the thermal profile as listed in the datasheet. -
Page 26: Thermal Management Logic And Thermal Monitor Feature
Fortunately, there are numerous ways to reduce the power consumption of a processor, and Intel is aggressively pursuing low power design techniques. For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using more power efficient circuits can significantly reduce processor power consumption. -
Page 27: Prochot# Signal
® Thermal Management Logic and Thermal Monitor Feature—Intel Core 2 Duo E6400, E4300, ® ® and Intel Pentium Dual-Core E2160 Processor 4.2.1 PROCHOT# Signal The primary function of the PROCHOT# signal is to provide an external indication that the processor has exceeded its maximum operating temperature. While PROCHOT# is asserted, the TCC will be active. -
Page 28: Thermal Monitor 2
® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor—Thermal Management Logic and Thermal Monitor Feature Figure 7. Concept for Clocks under Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 4.2.3... -
Page 29: Operation And Configuration
® Thermal Management Logic and Thermal Monitor Feature—Intel Core 2 Duo E6400, E4300, ® ® and Intel Pentium Dual-Core E2160 Processor Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. -
Page 30: On-Demand Mode
4.2.6 System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all processors. The thermal control circuit is intended to protect against short term thermal excursions that exceed the capability of a well designed processor thermal solution. -
Page 31: Operating System And Application Software Considerations
4.2.10 Digital Thermal Sensor The Intel® Core™2 Duo desktop processor E6000 sequence introduces the Digital Thermal Sensor (DTS) as the on-die sensor to use for fan speed control (FSC). The DTS will eventually replace the on-die thermal diode used in previous products. The processor will have both the DTS and thermal diode enabled. -
Page 32: Platform Environmental Control Interface (Peci)
Core™2 Duo Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet. The PECI bus is available on pin G5 of the LGA 775 socket. Starting with the Intel ICH8, the IO Controller Hub has integrated a PECI host controller. The PECI interface and the ®... -
Page 33: Intel® Reference Thermal Solution
This is a basic thermal engineering parameter that may be used to evaluate and compare different thermal solutions in similar boundary conditions. An example of how Ψ is calculated for the Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for Embedded Applications is shown in Equation Equation 3. -
Page 34: Picmg 1.3 Form Factor
Intel has worked with a third party vendor to enable a heatsink design for the Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for Embedded Applications for the PICMG 1.3 form factor. -
Page 35: Picmg 1.3 Copper Heatsink
® ® ® Intel® Reference Thermal Solution—Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor Figure 11. PICMG 1.3 Copper Heatsink Based on lab test data, the case-to-ambient (Ψ ) performance of heatsink was found to be 0.356 °C/W with 18 CFM of airflow through the heatsink fins. This will allow a maximum T of 39 °C and meet the processors Thermal Profile specification as... -
Page 36: Atx/Btx Form Factors
ATX/BTX form factors For information regarding the Intel Thermal/Mechanical Reference Design thermal ® solution and design criteria for the ATX and BTX form factor, refer to the Intel Core™2 Duo Desktop Processor E6000 Sequence Thermal and Mechanical Design Guidelines. Altitude The reference heatsink solutions will be evaluated at sea level. -
Page 37: Geometric Envelope For Intel Reference Picmg 1.3 Thermal Mechanical Design
The system designer needs to account for altitude effects in the overall system thermal design to make sure that the T requirement for the processor is met at the targeted altitude. Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design Figure 20 Figure 21 Appendix D give detailed reference PICMG 1.3 motherboard... -
Page 38: Intel® Quiet System Technology (Intel® Qst)
The ME provides integrated fan speed control in lieu of the mechanisms available in a SIO or a stand-alone ASIC. The Intel QST is time based as compared to the linear or state control used by the current generation of FSC devices. -
Page 39: Output Weighting Matrix
6.1.1 Output Weighting Matrix Intel QST provides an Output Weighting Matrix that provides a means for a single thermal sensor to affect the speed of multiple fans. An example of how the matrix could be used is if a sensor located next to the memory is sensitive to changes in both the processor heatsink fan and a second fan in the system. -
Page 40: Pid Controller Fundamentals
• Ki = Integral gain • Kd = derivative gain The Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual provides initial values for the each of the gain constants. In addition it provides a methodology to tune these gain values based on system response. Finally the fan speed change will be calculated using the following formula: Δ... -
Page 41: Board And System Implementation Of Intel® Qst
• ME system (S0-S1) with Controller Link connected and powered • DRAM with Channel A DIMM 0 installed and 2MB reserved for Intel® QST FW execution • SPI Flash with sufficient space for the Intel® QST Firmware •... -
Page 42: Example Acoustic Fan Speed Control Implementation
Intel has engaged with a number of major manufacturers of thermal / voltage sensors to provide devices for the SST bus. Contact your Intel Field Sales representative for the current list of manufacturers and visit their web sites or local sales representatives for a part suitable for your design. -
Page 43: Intel
® Fan Hub Thermistor and Intel There is no closed loop control between Intel QST and the thermistor, but they can work in tandem to provide the maximum fan speed reduction. The BTX reference design includes a thermistor on the fan hub. This Variable Speed Fan curve will determine the maximum fan speed as a function of the inlet ambient temperature, and by design, provides a Ψ... -
Page 44: Lga775 Socket Heatsink Loading
® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor—LGA775 Socket Heatsink Loading Appendix A LGA775 Socket Heatsink Loading LGA775 Socket Heatsink Considerations Heatsink clip load is traditionally used for: • Mechanical performance in mechanical shock and vibration •... -
Page 45: Board Deflection Configuration Definitions
® ® ® LGA775 Socket Heatsink Loading—Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor This board deflection metric provides guidance for mechanical designs that differ from the reference design for ATX//µATX form factor. A.2.2 Motherboard Deflection Metric Definition... -
Page 46: Board Deflection Definition
® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor—LGA775 Socket Heatsink Loading Figure 18. Board Deflection Definition d’1 d’2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: ≥ ≥ d_BOL - d_ref 0.09 mm... - Page 47 ® ® ® LGA775 Socket Heatsink Loading—Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor A.2.4 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions: • 72 mm x 72 mm hole pattern of the reference design.
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Page 48: Example: Defining Heatsink Preload Meeting Board Deflection Limit
Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends to design to {d_BOL - d_ref = 0.15mm} at BOL when EOL conditions are not known or difficult to assess. The following information is given for illustration only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness: d_ref is expected to be 0.18 mm on average, and be as high as 0.22 mm... -
Page 49: Heatsink Selection Guidelines
• The Intel RCFH-4 reference design available from licensed suppliers (refer to Appendix E for contact information) Intel will collaborate with vendors participating in its third party test house program to evaluate third party solutions. Vendor information will be available after product launch. -
Page 50: Thermal Interface Management
® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor—Thermal Interface Management Appendix B Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most effective thermal solution. -
Page 51: Case Temperature Reference Metrology
- Thermocouple Attach Using Solder - Video CD-ROM - is available. For information on case temperature reference setup, tool use, and approach, please refer to Intel® Core™2 Duo Processor and Intel® Pentium® Dual Core Processor Thermal and Mechanical Design Guidelines, Appendix D. - Page 52 Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description Page Number Figure 20, “PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components, Primary Side”...
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Page 53: Mechanical Drawings
® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor— Mechanical Drawings Figure 20. PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components, Primary Side ® ® ® Intel Core 2 Duo E6400, E4300, and Intel... -
Page 54: Picmg 1.3 Motherboard Keep-Out, Secondary Side
® ® ® Mechanical Drawings—Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor Figure 21. PICMG 1.3 Motherboard Keep-out, Secondary Side ® ® ® Intel Core 2 Duo E6400, E4300, and Intel Pentium Dual-Core E2160 Processor October 2007... -
Page 55: Intel® Enabled Reference Solution Information
Components Co., Ltd.) Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality or compatibility of these devices. This list and/or these devices may be subject to change without notice.