Table Of Contents - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Contents
1 Introduction ..............................................................................................................8
1.1 Reference Documents .......................................................................................... 9
1.2 Definition of Terms .............................................................................................. 9
2 Package Mechanical Specifications .......................................................................... 11
2.1 Package Mechanical Specifications ....................................................................... 11
2.1.1 Package Mechanical Drawing.................................................................... 12
2.1.2 Processor Component Keep-Out Zones ...................................................... 15
2.1.3 Package Loading Specifications ................................................................ 15
2.1.4 Package Handling Guidelines.................................................................... 15
2.1.5 Package Insertion Specifications............................................................... 15
2.1.6 Processor Mass Specification .................................................................... 16
2.1.7 Processor Materials................................................................................. 16
2.1.8 Processor Markings................................................................................. 16
2.1.9 Processor Land Coordinates ..................................................................... 17
3 LGA1366 Socket ...................................................................................................... 18
3.1 Board Layout .................................................................................................... 20
3.2 Attachment to Motherboard ................................................................................ 21
3.3 Socket Components........................................................................................... 21
3.3.1 Socket Body Housing .............................................................................. 21
3.3.2 Solder Balls ........................................................................................... 21
3.3.3 Contacts ............................................................................................... 22
3.3.4 Pick and Place Cover............................................................................... 22
3.4 Package Installation / Removal ........................................................................... 23
3.4.1 Socket Standoffs and Package Seating Plane.............................................. 23
3.5 Durability ......................................................................................................... 24
3.6 Markings .......................................................................................................... 24
3.7 Component Insertion Forces ............................................................................... 24
3.8 Socket Size ...................................................................................................... 24
3.9 LGA1366 Socket NCTF Solder Joints..................................................................... 24
4 Independent Loading Mechanism (ILM)................................................................... 26
4.1 Design Concept................................................................................................. 26
4.1.1 ILM Cover Assembly Design Overview ....................................................... 26
4.1.2 ILM Back Plate Design Overview ............................................................... 27
4.2 Assembly of ILM to a Motherboard....................................................................... 28
5 LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications .. 31
5.1 Component Mass............................................................................................... 31
5.2 Package/Socket Stackup Height .......................................................................... 31
5.3 Socket Maximum Temperature ............................................................................ 31
5.4 Loading Specifications........................................................................................ 33
5.4.1 Board Deflection Guidance....................................................................... 33
5.5 Electrical Requirements ...................................................................................... 34
5.6 Environmental Requirements .............................................................................. 35
6 Thermal Specifications ............................................................................................ 36
6.1 Package Thermal Specifications ........................................................................... 36
6.1.1 Thermal Specifications ............................................................................ 36
6.1.2 Thermal Metrology ................................................................................. 47
6.2 Processor Thermal Features ................................................................................ 48
6.2.1 Processor Temperature ........................................................................... 48
6.2.2 Adaptive Thermal Monitor........................................................................ 48
August 2010
Order Number: 323107-002US
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
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