Thermal Solutions; Performance Targets; Boundary Conditions And Performance Targets - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Thermal Solutions

7
Thermal Solutions
This section describes 1U and ATCA reference heatsinks. These heatsink designs target
®
the Intel
processor.
7.1

Performance Targets

Table 7-1
heatsinks. These values are used to generate processor thermal specifications and to
provide guidance for heatsink design. Other Intel
thermal solutions may work with the same retention. See the Intel
5500 Series Thermal/Mechanical Design Guide.
Note: Custom heatsinks and high airflow ATCA designs can cool higher power processors than
typical ATCA.
Table 7-1.

Boundary Conditions and Performance Targets

Parameter
Altitude, system
ambient temp
TDP
1,4
T
LA
Ψ 2
CA
System form
3
factor
Heatsink
volumetric
Heatsink
technology
Note:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3σ) for thermal characterization parameter
3. Reference system configuration. Processors are not limited to these form factors.
4. Local Ambient Temperature written 45/60
Short-Term NEBS excursions.
5. Passive heatsinks with TIM.
August 2010
Order Number: 323107-002US
®
Xeon processor C5500/C3500 series and thermal design guidelines for the
provides boundary conditions and performance targets for 1U and ATCA
85 W 65 W
o o
52 C 55 C
o
0.303 C/W 0.302
1U 1U
90 x 90 x 27 mm (1U)
Cu base, Al fins
5
®
Xeon
Value
Sea level, 40
30 W 60 W
o
55 C 52/67
o o
C/W 0.313 C/W 0.302
1U 1U or ATCA
1U or Custom
ATCA
(Section
o o
C means 45 C under Nominal conditions but 60
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
®
Processor 5500 Series
® ®
Xeon Processor
o
C
48 W 35 W
o o
C 52/67 C 45/60
o o
C/W 0.532 C/W 0.970
ATCA ATCA or
Dense Blade
90 x 90 x 13 90 x 90 x 13
mm mm
Cu base, Cu fins
7.5.1).
o
C is allowed for
Thermal/Mechanical Design Guide
o
C
o
C/W
54