Attachment To Motherboard; Socket Components; Socket Body Housing; Solder Balls - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

3.2

Attachment to Motherboard

The socket is attached to the motherboard by 1366 solder balls. There are no additional
external methods (i.e. screw, extra solder, adhesive, etc.) to attach the socket. As
indicated in
during the attach (reflow) process.
Figure 3-4.

Attachment to Motherboard

3.3

Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. See
3.3.1

Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260°C for 40 seconds (typical reflow/rework). The socket coefficient of
thermal expansion (in the XY plane), and creep properties, must be such that the
integrity of the socket is maintained for the conditions listed in
The color of the housing will be dark as compared to the solder balls. This provides the
contrast needed for pick and place vision systems.
3.3.2

Solder Balls

A total of 1366 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and
4% and a melting temperature of approximately 217°C. The alloy must be
compatible with immersion silver (ImAg) motherboard surface finish and a SAC
alloy solder paste.
The co-planarity (profile) and true position requirements are defined in
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
21
Figure 3-4, the Independent Loading Mechanism (ILM) is not present
LGA1366 Socket
Appendix C for detailed drawings.
Section 8.
Appendix
Order Number: 323107-002US
C.
August 2010