Electrical Requirements; Electrical Requirements For Lga1366 Socket - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Xeon processor c5500/c3500 series and lga1366 socket hermal/mechanical design guide
Hide thumbs Also See for X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor:
Table of Contents

Advertisement

5.5

Electrical Requirements

LGA1366 socket electrical requirements are measured from the socket-seating plane of
the processor to the component side of the socket PCB to which it is attached. All
specifications are maximum values (unless otherwise stated) for a single socket
contact, but includes effects of adjacent contacts where indicated.
Table 5-4.

Electrical Requirements for LGA1366 Socket

Mated loop inductance, loop
Mated partial mutual inductance, L
Maximum mutual capacitance, C
Socket Average Contact Resistance
(EOL)
Max Individual Contact Resistance
(EOL)
Bulk Resistance Increase
Dielectric Withstand Voltage
Insulation Resistance
®
®
Intel
Xeon
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
34
LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications
Parameter
<3.9 nH
NA
<1 pF
15.2 mΩ
≤ 100 mΩ
≤ 3 mΩ
360 Volts RMS
800 MΩ
Value
The inductance calculated for two contacts,
considering one forward conductor and one
return conductor. These values must be satisfied
at the worst-case height of the socket.
The inductance on a contact due to any single
neighboring contact.
The capacitance between two contacts
The socket average contact resistance target is
derived from average of every chain contact
resistance for each part used in testing, with a
chain contact resistance defined as the
resistance of each chain minus resistance of
shorting bars divided by number of lands in the
daisy chain.
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land.
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land; gaps included.
The bulk resistance increase per contact from
24° C to 107° C
Comment
August 2010
Order Number: 323107-002US

Advertisement

Table of Contents
loading

This manual is also suitable for:

X3350 2.66 l2 1333mhz lga775

Table of Contents