Processor Lc3528 Thermal Profile; Xeon Processor Lc3518 Thermal Profile; Processor Lc3528 Thermal Specifications - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Thermal Specifications
®
Table 6-11. Intel Xeon
Core
Frequency
Launch to FMB
Notes:
1. These values are specified at V
the processor is not to be subjected to any static V
specified ICC. See the loadline specifications in the Datasheet.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
3. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
4. Power specifications are defined at all VIDs found in the Datasheet. The Intel
C3500 series may be shipped under multiple VIDs for each frequency.
5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency
requirements.
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Figure 6-6. Intel Xeon
Notes:
®
1. Intel
See Table 6-12
2. Implementation of Intel
in virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet this Thermal
Profile will result in increased probability of TCC activation and may incur measurable performance loss.
3. The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
4. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances
per year, as compliant with NEBS Level 3. Operation at the Short-Term Thermal Profile for durations
exceeding 360 hours per year violate the processor thermal specifications and may result in permanent
damage to the processor.
August 2010
Order Number: 323107-002US
®

Processor LC3528 Thermal Specifications

Thermal Design
Power
(W)
35
CC_MAX
®

Processor LC3528 Thermal Profile

100
Short-term Thermal Profile may only be used for
90
short term excursions to higher ambient
temperatures, not to exceed 360 hours per year
80
Short-Term Thermal Profile
Tc = 0.970 * P + 60
70
60
50
40
0 5 10
Xeon® processor LC3528 Thermal Profile is representative of a volumetrically constrained platform.
for discrete points that constitute the thermal profile.
® ®
Xeon processor LC3528 nominal and short-term thermal profiles should result
Minimum Maximum
T T
CASE CASE
(°C) (°C)
5 See Figure 6-6;
for all processor frequencies. Systems must be designed to ensure
and I combination wherein V
CC CC
Thermal Profile
Nominal Thermal Profile
Tc = 0.970 * P + 45
15 20
Power [W]
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Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Notes
Table 6-12 1, 2, 3, 4, 5
exceeds V
CC CC_MAX
.
CASE
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Xeon processor C5500/
25 30 35
Thermal/Mechanical Design Guide
at
44