Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual
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Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Thermal/mechanical design guidelines
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Quad-Core Intel® Xeon® Processor
5300 Series
Thermal/Mechanical Design Guidelines
April 2007
Document Number: 315794, Revision: 002

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Summary of Contents for Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor

  • Page 1 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines April 2007 Document Number: 315794, Revision: 002...
  • Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel's website at http://www.intel.com.

  • Page 3: Table Of Contents

    Heatsink Solutions.................. 37 2.4.2 Thermal Interface Material............... 38 2.4.3 Summary ....................39 2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design... 40 2.4.5 Thermal Solution Performance Characteristics ..........42 2.4.6 Thermal Profile Adherence ............... 43 2.4.7 Components Overview ................47 2.4.8...
  • Page 4 TCONTROL Value and Digital Thermal Sensor Value Interaction........25 TCONTROL and Thermal Profile Interaction............26 2-10 Dual Thermal Profile Diagram ................27 2-11 Thermal Profiles A and B for the Quad-Core Intel® Xeon® Processor X5300 Series ......................29 2-12 Thermal Profile for Quad-Core Intel® Xeon® Processor E5300 Series .......30 2-13 Thermal Profile for Quad-Core Intel®...
  • Page 5 B-24 1U Alternative Heatsink (4 of 4) ................83 Load Cell Installation in Machined Heatsink Base Pocket - Bottom View..... 86 Load Cell Installation in Machined Heatsink Base Pocket - Side View......87 Preload Test Configuration.................. 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 6 Reference Documents..................9 Terms and Descriptions ..................10 Processor Mechanical Parameters Table ..............13 Input and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features ..............22 Processor Core Geometric Center Dimensions ............23 Intel Reference Heatsink Performance Targets for the Quad-Core Intel®...

  • Page 7: Revision History

    November 2006 • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design 315794 April 2007 chapter • Add mechanical drawings Figures B-21 – B-24 § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 8 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 9: Introduction

    The purpose of this guide is to describe the reference thermal solution and design parameters required for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor X5300 Series refers to the 120W TDP skus of the product. These processors are performance-optimized and provide optimal overall performance.

  • Page 10: Definition Of Terms

    Thin Electronics Bay Specification (A Server System Infrastructure (SSI) www.ssiforum.com Specification for Rack Optimized Servers Note: Contact your Intel field sales representative for the latest revision and order number of this document. Definition of Terms Table 1-2. Terms and Descriptions (Sheet 1 of 2)
  • Page 11 A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 12 Introduction Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 13: Thermal/Mechanical Reference Design

    3.95 Notes: Refer to drawings in Appendix In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Table 2-1 above. These socket limits are defined in the LGA771 Socket Mechanical Design Guide.

  • Page 14: Quad-Core Intel® Xeon® Processor 5300 Series Package

    2-1, Figure 2-2 Figure 2-3 provide the mechanical information for Quad- Core Intel® Xeon® Processor 5300 Series. The stackup height of the processors in the socket is shown in Appendix B. The drawing is superseded with the drawing in the processor Datasheet, should there be any conflicts.

  • Page 15: Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 Of 3)

    Thermal/Mechanical Reference Design Figure 2-1. Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 16: Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 Of 3)

    Thermal/Mechanical Reference Design Figure 2-2. Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 17: Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 Of 3)

    Thermal/Mechanical Reference Design Figure 2-3. Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 18: Quad-Core Intel® Xeon® Processor 5300 Series Considerations

    The Intel reference design for Quad-Core Intel® Xeon® Processor 5300 Series is using such a heatsink attachment scheme. Refer to Section 2.4...

  • Page 19: Processor Case Temperature Measurement Location

    Thermal Monitor 2 activation adjusts both the processor operating frequency (via the bus multiplier) and input voltage (via the VID signals). Please refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for further details on TM and TM2.

  • Page 20: Digital Thermal Sensor

    Datasheet. In addition, on-die thermal management features called THERMTRIP# and FORCEPR# are available on the Quad-Core Intel® Xeon® Processor 5300 Series. They provide a thermal management approach to support the continued increases in processor frequency and performance. Please see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for guidance on these thermal management features.

  • Page 21: Multiple Core Special Considerations

    Digital Thermal Sensors located on the die. Each die within the processor currently maps to a PECI domain. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and each die contains two cores. BIOS will be responsible for detecting the proper processor type and providing the number of domains to the thermal management system.

  • Page 22: Input And Output Conditions For The Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features

    All Cores TCC Activation FORCEPR# Notes: X=1,2,3,4; represents any one of the core1, core2, core3 and core4 in Quad-Core Intel® Xeon® Processor 5300 Series. For more information on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet.

  • Page 23: Processor Core Geometric Center Locations

    Processor Core Geometric Center Dimensions Feature X Dimension Y Dimension Core 1 19.53 mm 6.41 mm Core 2 19.53 mm 10.56 mm Core 3 19.53 mm 18.94 mm Core 4 19.53 mm 23.09 mm Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 24: Thermal Profile

    2.3.3). There can be multiple combinations of thermal solution case-to-ambient resistance and processor local ambient temperature that can meet a given Thermal Profile. If the case-to-ambient resistance and the local ambient Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 25: Tcontrol Definition

    Time The value for T is calibrated in manufacturing and configured for each processor CONTROL individually. For the Quad-Core Intel® Xeon® Processor 5300 Series, the T CONTROL value is obtained by reading a processor model specific register (IA32_TEMPERATURE_TARGET MSR). Note: There is no T value to sum as previously required on legacy processors.

  • Page 26: Thermal Profile Concepts For The Quad-Core Intel® Xeon® Processor 5300 Series

    Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is designed to go into various form factors, including the volumetrically constrained 1U and custom blade form factors. Due to certain limitations of such form factors (i.e. airflow, thermal solution height), it is very challenging to meet the thermal requirements of the processor.

  • Page 27: Dual Thermal Profile Diagram

    Power Power The Thermal Profile A is based on Intel’s 2U+ air cooling solution. Designing to Thermal Profile A ensures that no measurable performance loss due to Thermal Control Circuit (TCC) activation is observed in the processor. It is expected that TCC would only be activated for very brief periods of time when running a worst-case real world application in a worst-case thermal condition.

  • Page 28: Performance Targets

    Thermal Profile A and Thermal Profile B specifications. Section 2.4 of this document also provides details on the 2U+ and 1U Intel reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A and Thermal Profile B respectively.

  • Page 29: Thermal Profiles A And B For The Quad-Core Intel® Xeon® Processor X5300

    Thermal/Mechanical Reference Design Figure 2-11. Thermal Profiles A and B for the Quad-Core Intel® Xeon® Processor X5300 Series is a thermal solution design point. In actuality, units will CASE_MAX not significantly exceed T due to TCC activation. CASE_MAX_A Thermal Profile B Y = 0.224*x + 43.1...

  • Page 30: Thermal Profile For Quad-Core Intel® Xeon® Processor E5300 Series

    Thermal/Mechanical Reference Design Figure 2-12. Thermal Profile for Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile Thermal Profile Y = 0.293*x + 42.6 Y = 0.293*x + 42.6 Power [W] Power [W] Note: The thermal specifications shown in this graph are for reference only. Refer to the Quad-Core Intel®...

  • Page 31: Thermal Profile For Quad-Core Intel® Xeon® Processor L5300 Series

    Thermal/Mechanical Reference Design Figure 2-13. Thermal Profile for Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile Thermal Profile Y = 0.360*x + 42.0 Y = 0.360*x + 42.0 Pow er [W] Pow er [W] Note: The thermal specifications shown in this graph are for reference only. Refer to the Quad-Core Intel®...

  • Page 32: Intel Reference Heatsink Performance Targets For The Quad-Core Intel® Xeon® Processor X5300 Series

    / hr 25.5 0.331 Inches of H Pressure Drop 82.4 ψ 0.249 °C/W Mean + 3σ Note: In case of conflict, the processor Datasheet supersedes the information contained in the TMDG Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 33: Characterizing Cooling Solution Performance Requirements

    2.2.6, is to be used in FSC designs to ensure that the CONTROL long-term reliability of the processor is met while keeping the system level acoustic noise down. Figure 2-14 depicts the relationship between T and FSC CONTROL methodology. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 34: Tcontrol And Fan Speed Control

    Regardless of which scheme is employed, system designers must ensure that the Thermal Profile specification is met when the processor Digital Thermal Sensor temperature exceeds the T value for a given processor. CONTOL Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 35: Processor Thermal Characterization Parameter Relationships

    It is also strongly dependent on the air velocity through the fins of the heatsink. Figure 2-15 illustrates the combination of the different thermal characterization parameters. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 36: Processor Thermal Characterization Parameter Relationships

    The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any Intel processor thermal specifications, and are for illustrative purposes only. Assume the Datasheet TDP is 85 W and the case temperature specification is 68 °C.

  • Page 37: Chassis Thermal Design Considerations

    The length, thickness, and conductivity of the conduction path from Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 38: Thermal Interface Material

    CASE the type of TIM material. Refer to Section 2.4.7.2 for information on the TIM used in the Intel reference heatsink solution. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 39: Summary

    • Development of airflow entering and within the heatsink area. • Physical volumetric constraints placed by the system. • Integrated package/socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 40: Assembly Overview Of The Intel Reference Thermal Mechanical Design

    Assembly Overview of the Intel Reference Thermal Mechanical Design The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5300 Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the following components: •...
  • Page 41 CEK (Pro/Engineer*, IGES and Icepak*, Flotherm* formats). Pro/Engineer, Icepak and Flotherm models are available on Intel Business Link (IBL). Note: Intel reserves the right to make changes and modifications to the design as necessary. Note: The thermal mechanical reference design for the Quad-Core Intel® Xeon® Processor...

  • Page 42: Thermal Solution Performance Characteristics

    Thermal/Mechanical Reference Design for structural support and stiffening on the chassis. Intel has published a best known method (BKM) document that provides specific structural guidance for designing DCA thermal solutions. The document is titled Chassis Strength and Stiffness Measurement and Improvement Guidelines for Direct Chassis Attach Solutions.

  • Page 43: Thermal Profile Adherence

    Thermal/Mechanical Reference Design Figure 2-18. 1U CEK Heatsink Thermal Performance 2.4.6 Thermal Profile Adherence The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the Quad-Core Intel® Xeon® Processor X5300 Series. From Table 2-4, the three- sigma (mean+3sigma) performance of the thermal solution is computed to be 0.190 °C/W and the processor local ambient temperature (T...

  • Page 44: Cek Thermal Adherence To Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A

    CASE_MAX_A _PROFILE_MIN_A Power (W) _PROFILE_MIN_A The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the Quad-Core Intel® Xeon® Processor X5300 Series. From Table 2-4 the three- sigma (mean+3sigma) performance of the thermal solution is computed to be 0.249 °C/W and the processor local ambient temperature (T...

  • Page 45: Cek Thermal Adherence To Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile B

    CASE_MAX_B _PROFILE_MIN_B Power (W) _PROFILE_MIN_B The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor E5300 Series in volumetrically constrained form factors. From Table 2-5 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.249 °C/W and the processor local ambient...

  • Page 46: Cek Thermal Adherence To Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile

    CASE_MAX _PROFILE_MIN Power (W) _ PROFILE _MIN The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor L5300 Series in volumetrically constrained form factors. From Table 2-6 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.249 °C/W and the processor local ambient...

  • Page 47: Components Overview

    Thermal/Mechanical Reference Design Figure 2-22. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile @ TDP CASE_MAX Thermal Profile Y=0.360*X+42 CASE_MAX _PROFILE_MIN 1U CEK Reference Solution Y=0.249*X+40 _ PROFILE _MIN Power (W) Note: Intel has also developed an 1U alternative reference heatsink design. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel®...

  • Page 48: Isometric View Of The 2U+ Cek Heatsink

    Although the CEK heatsink fits into the legacy volumetric keep-in, it has a larger footprint due to the elimination of retention mechanism and clips used in the older enabled thermal/mechanical components. This allows the heatsink to grow its base and Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 49: Cek Heatsink Thermal Mechanical Characteristics

    The CEK reference solution is designed to apply a compressive load of up to 133N [30 lbf] on the TIM to improve the thermal performance. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 50: Cek Spring Isometric View

    Please refer to Appendix B for more detailed mechanical drawings of the CEK spring. Also, the baseboard keepout requirements shown in Appendix B must be met to use this CEK spring design. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 51: Boxed Active Thermal Solution For The Quad-Core Intel® Xeon® Processor 5300 Series

    Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series Intel will provide a 2U passive and a 1U passive/active heatsink solution for boxed Quad-Core Intel® Xeon® Processor 5300 Series. This active heatsink solution is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and side directional airflow is not an issue.

  • Page 52: Fan Cable Connection (Active Cek)

    IC: Fan Current Draw 1.25 SENSE: SENSE Frequency Pulses per fan revolution Note: System board should pull this pin up to V with a resistor. Figure 2-28. Fan Cable Connection (Active CEK) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 53: Fan Cable Connector Pin Out (Active Cek)

    • Unattached heatsink solution • 4 screws, 4 springs, and 4 heatsink standoffs (all captive to the heatsink) • Thermal Interface Material (pre-applied on heatsink) • Installation Manual ® • Intel Inside logo Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 54 They are as follows: • CEK Spring (supplied by baseboard vendors) • Heatsink standoffs (supplied by chassis vendors) § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 55: A 1U Alternative Heatsink Thermal/Mechanical Design

    Processor L5300 Series thermal profile specifications. Component Overview The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the same volumetric footprint as the 1U CEK heatsink. It reuses Intel 1U CEK Captive standoff/screws, Thermal Interface Material (TIM) and Spring. Figure A-1 shows the isometric view of the 1U alternative heatsink.

  • Page 56: Thermal Solution Performance Characteristics

    Target Airflow Standard Size Mean Ψ Drop Through Fins Deviation Ψ (Pa) [in (mm) [in.] (kg) [lbs] /hr) [CFM] (°C/W) (°C/W) 27.00 0.24 [0.53] 25.5 [15] 0.304 0.007 82.4 [0.331] [1.06] Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 57: Thermal Profile Adherence

    Figure A-3 below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 1.8°C margin at the lower end (P ) and 0°C margin at the upper end (TDP).

  • Page 58: Processor L5300 Series Thermal Profile

    Figure A-4 below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 2.8°C margin at the lower end (P ) and 3.7°C margin at the upper end (TDP).

  • Page 59: Mechanical Drawings

    The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Quad-Core Intel® Xeon® Processor 5300 Series. Note: Intel reserves the right to make changes and modifications to the design as necessary. Table B-1. Mechanical Drawing List...
  • Page 60 Mechanical Drawings Figure B-1. 2U CEK Heatsink (Sheet 1 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 61 Mechanical Drawings Figure B-2. 2U CEK Heatsink (Sheet 2 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 62 Mechanical Drawings Figure B-3. 2U CEK Heatsink (Sheet 3 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 63 Mechanical Drawings Figure B-4. 2U CEK Heatsink (Sheet 4 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 64 Mechanical Drawings Figure B-5. CEK Spring (Sheet 1 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 65 Mechanical Drawings Figure B-6. CEK Spring (Sheet 2 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 66 Mechanical Drawings Figure B-7. CEK Spring (Sheet 3 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 67: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 1 Of 6)

    Mechanical Drawings Figure B-8. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 68: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 2 Of 6)

    Mechanical Drawings Figure B-9. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 69: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 3 Of 6)

    Mechanical Drawings Figure B-10. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 70: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 4 Of 6)

    Mechanical Drawings Figure B-11. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 71: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 5 Of 6)

    Mechanical Drawings Figure B-12. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 72: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 6 Of 6)

    Mechanical Drawings Figure B-13. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 73 Mechanical Drawings Figure B-14. 1U CEK Heatsink (Sheet 1 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 74 Mechanical Drawings Figure B-15. 1U CEK Heatsink (Sheet 2 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 75 Mechanical Drawings Figure B-16. 1U CEK Heatsink (Sheet 3 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 76 Mechanical Drawings Figure B-17. 1U CEK Heatsink (Sheet 4of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 77: Active Cek Thermal Solution Volumetric (Sheet 1 Of 3)

    Mechanical Drawings Figure B-18. Active CEK Thermal Solution Volumetric (Sheet 1 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 78: Active Cek Thermal Solution Volumetric (Sheet 2 Of 3)

    Mechanical Drawings Figure B-19. Active CEK Thermal Solution Volumetric (Sheet 2 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 79: Active Cek Thermal Solution Volumetric (Sheet 3 Of 3)

    Mechanical Drawings Figure B-20. Active CEK Thermal Solution Volumetric (Sheet 3 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 80 Mechanical Drawings Figure B-21. 1U Alternative Heatsink (1 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 81 Mechanical Drawings Figure B-22. 1U Alternative Heatsink (2 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 82 Mechanical Drawings Figure B-23. 1U Alternative Heatsink (3 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 83: B-24 1U Alternative Heatsink (4 Of 4)

    Mechanical Drawings Figure B-24. 1U Alternative Heatsink (4 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 84 Mechanical Drawings § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 85: C Heatsink Clip Load Methodology

    • Heatsink preload for the LGA771 socket. • Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel is continuously exploring new ways to improve metrology. Updates will be provided later as this document is revised as appropriate.

  • Page 86: Load Cell Installation In Machined Heatsink Base Pocket - Bottom View

    Heatsink Base Heatsink Base Pocket Pocket Package IHS Package IHS Diameter ~ Diameter ~ Outline (Top Outline (Top 29 mm 29 mm Surface) Surface) [~1.15”] [~1.15”] Load Load Cells Cells Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 87: Load Cell Installation In Machined Heatsink Base Pocket - Side View

    ~ height pocket ~ height of selected of selected load cell load cell Figure C-3. Preload Test Configuration Preload Fixture (copper core with milled out pocket) Load Cells (3x) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 88: Typical Test Equipment

    3. Assemble the heatsink reworked with the load cells to motherboard as shown for the Quad-Core Intel® Xeon® Processor 5300 Series CEK-reference heatsink example in Figure C-3, and actuate attach mechanism. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 89: Preload Degradation Under Bake Conditions

    Sample rate = 0.01 Hz for the remainder of the bake test 5. Remove assembly from thermal chamber and set into room temperature conditions 6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 90 Heatsink Clip Load Methodology Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 91: D Safety Requirements

    UL94V-2 approved. 2. CSA Certification. All mechanical and thermal enabling components must have CSA certification. 3. Heatsink fins must meet the test requirements of UL1439 for sharp edges. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Page 92 Safety Requirements Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 93: E Quality And Reliability Requirements

    Environmental Reliability Testing E.1.2.1 Structural Reliability Testing The Intel reference heatsinks will be tested in an assembled condition, along with the LGA771 Socket. Details of the Environmental Requirements, and associated stress tests, can be found in the LGA771 Socket Mechanical Design Guide.

  • Page 94: Use Conditions Environment

    2. Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 95: Material And Recycling Requirements

    • All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test.
  • Page 96 Quality and Reliability Requirements Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

  • Page 97: F Enabled Suppliers Information

    ® The Intel reference enabling solution for Quad-Core Intel Xeon Processor 5300 Series is preliminary. The Intel reference solutions have not been verified to meet the criteria outlined in Appendix E. Customers can purchase the Intel reference thermal solution components from the suppliers listed in Table F-1.

  • Page 98: Additional Suppliers

    Material CEK Spring for See CEK771-01-2U CEK771 Note: CEK771-02-1U is the 1U alternative reference heatsink design for Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series in volumetrically constrained form factors. F.1.2 Additional Suppliers ® ®...

  • Page 99: Intel Reference Solution

    +886-2-3234-0050x235 - and - Aluminum Copper Fin Taisol Electronics Jane Yui Copper Base CNDA #3434254 jane.yui@taisol.com.tw +886-2-2656-2658x113 - and - Aluminum Copper Fin Thermaltake Vera Lee Copper Base vera@thermaltake.com CNDA#7429482 +886-2-2662-6501-255 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines...
  • Page 100 Copper Fin Taisol Electronics Jane Yui Copper Base CNDA #3434254 jane.yui@taisol.com.tw +886-2-2656-2658x113 - and - Aluminum Copper Fin, Thermaltake Vera Lee Copper Base vera@thermaltake.com CNDA#7429482 +886-2-2662-6501-255 - and - Aluminum § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines...

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