A Component Suppliers; Heatsinks And Thermal Interface Material - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Component Suppliers
A Component Suppliers
The part numbers below represent Intel reference designs and collaborative designs for
1U and ATCA heatsinks. These components are still in development and might not meet
the criteria in
and require validation by the customer. Customers can obtain these components
directly from the suppliers below.
Table A-1.

Heatsinks and Thermal Interface Material

Component
1U Reference
Heatsink
p/n E32409-001
ATCA
Reference
heatsink
p/n E65918-001
Thermal
Interface
Material
Note: Performance targets for heatsinks are described in
are provided in
assemble to server back plate
August 2010
Order Number: 323107-002US
Section 8. Customer implementation of these components may be unique
Description
1U Aluminum Fujikura
Fin, Copper Base
HSA-8078 Rev A
ATCA Copper Fin, Fujikura
Copper Base
HSA-7901-B
Phase Change Honeywell
PCM45F
Appendix B. Mechanical models are listed in
(Table
Intel
Supplier PN
Fujikura America
Yuji Yasuda
yuji@fujikura.com
408-988-7478
Fujikura Taiwan Branch
Yao-Hsien Huang
yeohsien@fujikuratw.com.tw
886(2)8788-4959
Fujikura America
Yuji Yasuda
yuji@fujikura.com
408-748-6991
Fujikura Taiwan Branch
Yao-Hsien Huang
yeohsien@fujikuratw.com.tw
886(2)8788-4959
Scott Miller
509-252-2206
scott.miller4@honeywell.com
Paula Knoll
858-279-2956
paula_knoll@honeywell.com
Section 7.1. Mechanical drawings
Table
A-2).
® ®
Xeon Processor C5500/C3500 Series and LGA1366 Socket
Supplier Contact Info
1-1. Heatsinks
Thermal/Mechanical Design Guide
70