Lga1366 Socket And Ilm Electrical, Mechanical And Environmental Specifications; Component Mass; Package/Socket Stackup Height; Socket Maximum Temperature - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications

5
LGA1366 Socket and ILM
Electrical, Mechanical and
Environmental Specifications
This chapter describes the electrical, mechanical and environmental specifications for
the LGA1366 socket and the Independent Loading Mechanism.
5.1

Component Mass

Table 5-1.

Socket Component Mass

Socket body, contacts, and PnP cover
ILM cover
ILM back plate for dual processor server products
Notes:
1. Preliminary guidance.
5.2

Package/Socket Stackup Height

Table 5-2
LGA1366 socket with the ILM closed and the processor fully seated in the socket.
Table 5-2.

1366-land Package and LGA1366 Socket Stackup Height

Integrated stackup height (mm)
From top of board to top of IHS
Notes:
1. This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in
package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that
are given in the corresponding processor Datasheet.
2. This value is a RSS calculation.
5.3

Socket Maximum Temperature

The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the motherboard. Exceeding the
temperature guidance may result in socket body deformation, or increases in thermal
and electrical resistance which can cause a thermal runaway and eventual electrical
failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket < 96 °C
The specific via used for temperature measurement is located on the bottom of the
motherboard between pins AY23, AY22, AW23, and AW22. See
August 2010
Order Number: 323107-002US
Component
provides the stackup height of a processor in the 1366-land LGA package and
Mass
15 gm
43 gm
100 gm
7.729 ± 0.282 mm
Appendix C, (b) the height of the package, from the
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Figure 5-1.
Thermal/Mechanical Design Guide
31