Package Installation / Removal; Socket Standoffs And Package Seating Plane; Package Installation / Removal Features - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

3.4

Package Installation / Removal

As indicated in
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
.
Figure 3-6.

Package Installation / Removal Features

3.4.1

Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
23
Figure 3-6, access is provided to facilitate manual installation and
Pin1 triangle Pin1 triangle
access access
orientation orientation
post post
Pin1 chamfer Pin1 chamfer
Appendix
Section 5.2 for the calculated IHS height above the motherboard.
orientation orientation
notch notch
alignment alignment
walls walls
C.
LGA1366 Socket
August 2010
Order Number: 323107-002US