Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual page 4

6.2.3 THERMTRIP# Signal ................................................................................51
6.3 Platform Environment Control Interface (PECI) ......................................................51
6.3.1 Introduction ...........................................................................................51
6.3.2 PECI Specifications .................................................................................53
7 Thermal Solutions ....................................................................................................54
7.1 Performance Targets ..........................................................................................54
7.2 Heat Pipe Considerations ....................................................................................56
7.3 Assembly..........................................................................................................57
7.3.1 Thermal Interface Material (TIM) ..............................................................58
7.4 Structural Considerations....................................................................................58
7.5 Thermal Design .................................................................................................59
7.5.1 Thermal Characterization Parameter..........................................................59
7.5.2 NEBS Thermal Profile ..............................................................................60
7.5.3 Power Thermal Utility ..............................................................................61
7.6 Thermal Features...............................................................................................61
7.6.1 Fan Speed Control ..................................................................................61
7.6.2 PECI Averaging and Catastrophic Thermal Management ...............................62
7.6.3 Intel
7.6.4 Absolute Processor Temperature ...............................................................63
7.6.5 Custom Heat Sinks For UP ATCA ...............................................................63
8 Quality and Reliability Requirements .......................................................................66
8.1 Use Conditions ..................................................................................................66
8.2 Intel Reference Component Validation ..................................................................67
8.2.1 Board Functional Test Sequence ...............................................................67
8.2.2 Post-Test Pass Criteria.............................................................................68
8.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................68
8.3 Material and Recycling Requirements....................................................................68
A Component Suppliers ...............................................................................................70
B Mechanical Drawings ...............................................................................................72
C Socket Mechanical Drawings ....................................................................................89
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Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
4
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Turbo Boost Technology .................................................................62
August 2010
Order Number: 323107-002US