Introduction; Intel ® Xeon ® Processor C5500/C3500 Series Socket Stack-Up; Back Plate - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Introduction

1
Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for processors in the Picket Post platform. The components described in this document
include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back
plate.
®
Figure 1-1. Intel Xeon
Heatsink
Socket and ILM

Back Plate

The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Other processor specifications are provided in the Intel
C3500 Series Datasheet.
August 2010
Order Number: 323107-002US
®
Processor C5500/C3500 Series Socket Stack-up
Intel
® Xeon
® ®
Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
® Processor C5500/
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