Chapter 29 Recommended Soldering Conditions; Table 29-1: Soldering Conditions - NEC V850E/RS1 User Manual

V850E/RS1 should be soldered and mounted under the following recommended conditions.
For soldering methods and condition other than those recommended below, contact an NEC
Electronics sales representative. For technical information, see the follow website:
µPD70F3402GC(A1)-8EA
µPD70F3403GC(A)-8EA
µPD70F3403AGC(A)-8EA
Soldering Method
Infrared reflow
VPS
Partial heating
Note: After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable
Caution:
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Chapter 29 Recommended Soldering Conditions

Table 29-1: Soldering Conditions

Package peak temperature: 235°C,
Time: 30 seconds max. (at 210°C or higher),
Count: 3 times or less,
Exposure limits: 7days
for 20 to 72 hours)
Package peak temperature: 215°C,
Time: 25 to 40 seconds max. (at 200°C or higher),
Count: 3 times or less,
Exposure limits: 7days
for 20 to 72 hours)
Pin temperature: 350°C max.
Time: 3 seconds max. (per pin row)
storage period.
Do not use different soldering methods together.
User's Manual U16702EE3V2UD00
http://www.ee.nec.de
100-pin plastic LQFP (Fine pitch) (14 × 14)
100-pin plastic LQFP (Fine pitch) (14 × 14)
100-pin plastic LQFP (Fine pitch) (14 × 14)
Soldering Condition
Note
(after that, prebake at 125°C
Note
(after that, prebake at 125°C
Symbol of
Recommended
Soldering Condition
IR35-207-3
VP15-207-3
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833