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15. RECOMMENDED SOLDERING CONDITIONS
The µ PD754202 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
µ PD754202GS-×××-BA5
µ PD754202GS-×××-GJG
µ PD754202GS(A)-×××-BA5 : 20-pin plastic SOP (300 mil, 1.27-mm pitch)
µ PD754202GS(A)-×××-GJG : 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Soldering Method
Package peak temperature: 235 °C, Reflow time: 30 seconds or below
Infrared reflow
(at 210 °C or higher), Number of reflow processes: Twice or less
Package peak temperature: 215 °C, Reflow time: 40 seconds or below
VPS
(at 200 °C or higher), Number of reflow processes: Twice or less
Solder temperature: 260 °C or below, Flow time: 10 seconds or below,
Wave soldering
Number of flow processes: 1
Preheating temperature: 120 °C or below (package surface temperature)
Pin temperature: 300 °C or below, Time: 3 seconds or below (per side of device)
Partial heating
Caution Do not use different soldering methods together (except for partial heating).
Table 15-1. Surface Mounting Type Soldering Conditions
: 20-pin plastic SOP (300 mil, 1.27-mm pitch)
: 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Soldering Conditions
µ PD754202, 754202(A)
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
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