Chapter 21 Recommended Soldering Conditions - NEC 78K0S/KU1+ User Manual

CHAPTER 21 RECOMMENDED SOLDERING CONDITIONS

These products should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Cautions 1. Products with –A at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended below, contact an NEC
Electronics sales representative.
• 10-pin plastic SSOP (lead-free products)
µ
PD78F9200MA-CAC-A, 78F9201MA-CAC-A, 78F9202MA-CAC-A
Soldering Method
Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Wave soldering For details, contact an NEC Electronics sales representative.
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Table 21-1. Surface Mounting Type Soldering Conditions
Soldering Conditions
User's Manual U18172EJ2V0UD
Note
(after that, prebake at 125°C for
Recommended
Condition Symbol
IR60-107-3
−
−
295