Olympus MX63 Instructions Manual page 93

Semiconductor/fpd/industrial inspection microscopes
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Abbreviations used for objective
M
PL
Ex)
(Plan)
M: For metal (without cover)
LM: For long working distance metal
SLM: For super long working distance metal
LC: For observation through glass
Glossary in optical performance table
Working distance:
Distance between the top surface of the sample and the tip of the objective.
Numerical aperture: Important value that determines the performances (resolution, focal depth and brightness) of the objective.
Resolution ...................Increases in proportion to the numerical aperture.
Focal depth ...............Decreases in proportion to the numerical aperture.
Brightness ...................Increases in proportion to the square of the numerical aperture. (comparing with the
Resolution:
Indicates the limit where the objective can identify two approaching images using the distance between
2 points on the sample surface.
Focal depth:
Indicates the sample depth focused at the same time. The depth increases when the aperture diaphragm
is narrowed down and decreases when the numerical aperture of the objective becomes larger.
Field number:
Indicates the diameter of the image area visible by the eyepiece in mm.
Actual field:
Indicates the diameter of the field area on the sample surface in mm.
FL
N
None: Achromat: Corrects the aberration by 2 wavelengths (blue and red).
FL: Semi-apochromat: Corrects the color aberration in the visible range
(from blue-violet to red).
APO: Apochromat: Corrects the color aberration in the entire visible range
(from violet to red).
PL Plan: Corrects the image plane curvature around the field.
same magnification)
100
BD
None: For brightfield
BD: For brightfield/darkfield
BDP: For brightfield/darkfield, polarization
IR: For IR
Number: Objective magnification
None: UIS objective
N: UIS2 objective
MX63/MX63L
87
87

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