Power Delivery Checklist - Intel 810A3 Design Manual

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Design Checklist
Table 8-22. AC'97 Checklist (Continued)
Checklist Line Items
+5VDUAL/+5VSB
S/P-DIF_IN
AC_SDIN[3:2]
AC97_MSTRCLK
PC_BEEP
Table 8-23. Power Delivery Checklist
Checklist Line Items
All voltage regulator components meet
maximum current requirements
All regulator components meet thermal
requirements
If devices are powered directly from a
dual rail (i.e., not behind a power
regulator), then the RDSon of the FETs
used to create the dual rail must be
analyzed to ensure there is not too much
voltage drop across the FET.
Dropout Voltage
Voltage tolerance requirements are met
Total power consumption in S3 must be
less than the rated standby supply
current.
8-14
If an adequate power supply is available, this pin should be connected to +5Vdual or
+5Vsby. In the event that these planes cannot support the required power, it can be
connected to VCC5 core on the motherboard. An AMR card using this standby/dual
supply should not prevent basic operation if this pin is connected to core power.
Connect to ground on the motherboard.
No connect on the motherboard. The ICH supports a maximum of two codecs, which
should be attached to SDIN[1:0].
Connect to ground on the motherboard.
Should be routed through the audio codec. Care should be taken to avoid the
introduction of a pop when powering the mixer up or down.
Consider all loads on a regulator, including other regulators.
Ensure the voltage regulator components and dissipate the
required amount of heat.
"Dual" voltage rails may not be at the expected voltage.
The minimum dropout for all voltage regulators must be
considered. Take into account that the voltage on a dual rail may
not be the expected voltage.
See individual component specification for each voltage tolerance.
Adequate power must be supplied by power supply.
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Intel
810A3 Chipset Design Guide

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