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3.6
THRMDP and THRMDN
These traces (THRMDP and THRMDN) route the processor's thermal diode connections. The
thermal diode operates at very low currents and may be susceptible to crosstalk. The traces should
be routed close together to reduce loop area and inductance. Refer to
Figure 3-2. Routing for THRMDP and THRMDN
Rule
Length Equalization
Layer
3.7
Additional Considerations
•
Distribute Vtt with a wide trace. A 0.050" minimum trace is recommended to minimize DC
losses. Route the Vtt trace to all components on the host bus. Be sure to include decoupling
capacitors. Guidelines for Vtt distribution and decoupling are contained in
AP-907: Pentium
The Vtt voltage should be 1.5V ±3% for static conditions, and 1.5V ±9% for transient
•
condition.
•
Place resistor divider pairs for V
is needed at the processor. V
decoupling capacitors. Guidelines for V
907: Pentium
®
Intel
810A3 Chipset Design Guide
Signal Y
1 -- Maximize (min - 20 mils)
T H R M D P
T H E R M D N
1 -- Maximize (min - 20 mils)
Signal Z
route these traces parallel ±0.5"
route both on the same layer
III Processor Power Distribution Guidelines, Order # 245085.
generation at the GMCH component. No V
REF
is generated locally on the processor. Be sure to include
REF
III Processor Power Distribution Guidelines (Order # 245085).
SC242 Processor Design Guidelines
Figure
2 -- Minimize
distribution and decoupling are contained in AP-
REF
3-2.
generation
REF
3-5
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