Intel 810A3 Design Manual page 5

Chipset platform
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5.3
5.4
5.5
6
Clocking .....................................................................................................................6-1
6.1
6.2
6.3
6.4
6.5
7
System Design Considerations..................................................................................7-1
7.1
7.2
7.3
7.4
8
Design Checklist ........................................................................................................8-1
8.1
8.2
8.3
8.4
9
Third-Party Vendor Information..................................................................................9-1
A
PCI Devices/Functions/Registers/Interrupts ............................................................. A-1
®
Intel
810A3 Chipset Design Guide
5.2.2
Timing Requirements.....................................................................5-10
5.2.3
Cross-Talk Theory .........................................................................5-11
More Details and Insight .............................................................................5-13
5.3.1
Textbook Timing Equations ...........................................................5-13
5.3.2
Effective Impedance and Tolerance/Variation ...............................5-14
5.3.3
Frequency Decoupling ...................................................................5-14
5.3.4
Clock Routing.................................................................................5-17
5.4.1
V
Guardband............................................................................5-18
5.4.2
Ringback Levels.............................................................................5-18
5.4.3
Overdrive Region ...........................................................................5-18
5.4.4
Flight Time Definition and Measurement .......................................5-19
Conclusion ..................................................................................................5-19
Clock Generation ..........................................................................................6-1
Clock Architecture.........................................................................................6-2
Clock Routing Guidelines..............................................................................6-3
Capacitor Sites..............................................................................................6-6
Clock Power Decoupling Guidelines.............................................................6-6
Power Delivery..............................................................................................7-1
®
7.1.1
810A3 Chipset Power Delivery ..............................................7-1
7.1.2
LED Indicator for S0-S5 States........................................................7-5
Decoupling Guidelines ..................................................................................7-6
7.2.1
Decoupling........................................................................7-6
7.2.2
Phase Lock Loop (PLL) Decoupling ................................................7-6
7.2.3
82810A3 GMCH Decoupling Guidelines..........................................7-7
7.2.4
Ground Flood Planes........................................................................7-8
Thermal Design Power .................................................................................7-8
Power Sequencing........................................................................................7-9
Design Review Checklist ..............................................................................8-1
8.1.1
Design Checklist Summary ..............................................................8-1
Pullup and Pulldown Resistor Values .........................................................8-15
RTC.............................................................................................................8-16
Power Management Signals .......................................................................8-16
8.4.1
Power Button Implementation........................................................8-18
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