5.3
5.4
5.5
6
Clocking .....................................................................................................................6-1
6.1
6.2
6.3
6.4
6.5
7
7.1
7.2
7.3
7.4
8
Design Checklist ........................................................................................................8-1
8.1
8.2
8.3
8.4
9
A
®
Intel
810A3 Chipset Design Guide
5.2.2
5.2.3
Cross-Talk Theory .........................................................................5-11
5.3.1
5.3.2
5.3.3
5.3.4
Clock Routing.................................................................................5-17
5.4.1
V
Guardband............................................................................5-18
5.4.2
Ringback Levels.............................................................................5-18
5.4.3
Overdrive Region ...........................................................................5-18
5.4.4
Conclusion ..................................................................................................5-19
Clock Generation ..........................................................................................6-1
Clock Architecture.........................................................................................6-2
Capacitor Sites..............................................................................................6-6
Power Delivery..............................................................................................7-1
®
7.1.1
7.1.2
Decoupling Guidelines ..................................................................................7-6
7.2.1
Decoupling........................................................................7-6
7.2.2
7.2.3
7.2.4
Thermal Design Power .................................................................................7-8
Power Sequencing........................................................................................7-9
8.1.1
RTC.............................................................................................................8-16
8.4.1
v