Thermal/Emi Differences - Intel 810A3 Design Manual

2.2.10.2 Vtt Decoupling Design
For Itt = 3.0 A (max).
•
Nineteen - 0.1 uF capacitors in 0603 packages placed within 200 mils of AGTL+ termination
R-pack's, one capacitor for every two R-packs. These capacitors are shown on the outer
exterior of
Vref Decoup
•
Four - 0.1uF capacitors in 0603 package placed near V
2.2.11

Thermal/EMI Differences

Heatsink requirements will be different for FC-PGA processors from previous processors using
PPGA packaging. Refer to the processor datasheet for specific guidelines.
•
Increased power density for Intel
•
Different thermal design verification for FC-PGA compared to PPGA packaged processors.
®
Intel
Celeron processors).
•
New heatsink for FC-PGA package which is not backwards compatible with PPGA
processors.
•
New heatsink clips for FC-PGA processor heatsinks.
®
Intel 810A3 Chipset Design Guide
Figure 2-6. These are located on the motherboard.
l
ing Design
®
III processors are specified using Tjunction versus Tcase (used with Intel
Pentium
PGA370 Processor Design Guidelines
REF
® ®
Pentium III processor (approximately 27 W/cm
pins (within 500 mils).
2
).
®
2-13