Tektronix DSA8200 Service Manual page 63

DSA8200 Digital Serial Analyzer and Modules Service Manual
Table 4- 2: Internal inspection check list (cont.)
Item Inspect for
Semiconductors Loosely inserted in sockets.
Distorted pins.
Wiring and cables Loose plugs or connectors.
Burned, broken, or frayed wiring.
Chassis Dents, deformations, and dam-
aged hardware.
Cleaning Procedure — Interior. To clean the instrument interior, do the following
steps:
1. Blow off dust with dry, low-pressure, deionized air (approximately 9 psi).
2. Remove any remaining dust with a lint-free cloth dampened in isopropyl
alcohol (75% solution) and rinse with warm deionized water. (A cotton-
tipped applicator is useful for cleaning in narrow spaces and on circuit
boards.)
STOP. If, after doing steps 1 and 2, a module is clean upon inspection, skip the
remaining steps.
3. If steps 1 and 2 do not remove all the dust or dirt, the instrument may be
spray washed using a solution of 75% isopropyl alcohol by doing steps 4
through 8.
4. Gain access to the parts to be cleaned by removing easily accessible shields
and panels (see Removal and Installation Procedures).
5. Spray wash dirty parts with the isopropyl alcohol and wait 60 seconds for the
majority of the alcohol to evaporate.
6. Use hot (120 F to 140 F) deionized water to thoroughly rinse them.
7. Dry all parts with low-pressure, deionized air.
8. Dry all components and assemblies in an oven or drying compartment using
low-temperature (125 F to 150 F) circulating air.
Maintenance
Repair action
Firmly seat loose semiconduc-
tors. Remove devices that have
distorted pins. Carefully straight-
en pins (as required to fit the
socket), using long-nose pliers,
and reinsert firmly. Ensure that
straightening action does not
crack pins, causing them to
break off.
Firmly seat connectors. Repair or
replace modules with defective
wires or cables.
Straighten, repair, or replace
defective hardware.
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