Supplementary Information About The 144-Pin Rfp Powerpad™ Package - Texas Instruments TMS320C6722 User Manual

TMS320C6727, TMS320C6726, TMS320C6722
Floating-Point Digital Signal Processors
SPRS268E – MAY 2005 – REVISED JANUARY 2007
7.2 Supplementary Information About the 144-Pin RFP PowerPAD™ Package
7.2.1 Standoff Height
This section highlights a few important details about the 144-pin RFP PowerPAD™ package. Texas
Instruments' PowerPAD Thermally Enhanced Package Technical Brief
should be consulted before designing a PCB for this device.
As illustrated in
0.150 mm) is measured from the seating plane established by the three lowest package pins to the lowest
point on the package body. Due to warpage, the lowest point on the package body is located in the center
of the package at the exposed thermal pad.
Using this definition of standoff height provides the correct result for determining the correct solder paste
thickness. According to TI's
SLMA002), the recommended range of solder paste thickness for this package is between 0.152 mm and
0.178 mm.
Standoff Height
Figure 7-1. Standoff Height Measurement on 144-Pin RFP Package
108 Mechanical Data
Figure 7-1, the standoff height specification for this device (between 0.050 mm and
PowerPAD Thermally Enhanced Package Technical Brief
www.ti.com
(literature number SLMA002)
(literature number
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