Texas Instruments TMS320C6722 User Manual page 109

www.ti.com
7.2.2 PowerPAD™ PCB Footprint
Texas Instruments'
SLMA002) should be consulted when creating a PCB footprint for this device. In general, for proper
thermal performance, the thermal pad under the package body should be as large as possible. However,
the soldermask opening for the PowerPAD™ should be sized to match the pad size on the 144-pin RFP
package; as illustrated in
Thermal Pad on Top Copper
should be as large as Possible.
Figure 7-2. Soldermask Opening Should Match Size of DSP Thermal Pad
7.3 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
On the 144-pin RFP package, the actual size of the Thermal Pad is 5.4 mm
Submit Documentation Feedback
PowerPAD Thermally Enhanced Package Technical Brief
Figure 7-2.
TMS320C6727, TMS320C6726, TMS320C6722
Floating-Point Digital Signal Processors
SPRS268E – MAY 2005 – REVISED JANUARY 2007
Soldermask opening should be smaller and match
the size of the thermal pad on the DSP.
5.4 mm.
(literature number
Mechanical Data 109