Summary of Contents for Texas Instruments TMS320F2809
Page 1
TMS320F2809, TMS320F2808, TMS320F2806 TMS320F2802, TMS320F2801, TMS320C2802 TMS320C2801, TMS320F28016, TMS320F28015 Digital Signal Processors Data Manual PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TMS320C28x, Code Composer Studio, DSP/BIOS, MicroStar BGA, C28x, TI, TMS320C2000 are trademarks of Texas Instruments.
3.2.3 Peripheral Bus To enable migration of peripherals between various Texas Instruments (TI) DSP family of devices, the 280x devices adopt a peripheral bus standard for peripheral interconnect. The peripheral bus bridge multiplexes the various busses that make up the processor Memory Bus into a single bus consisting of 16 address lines and 16 or 32 data lines and associated control signals.
THE CODE SECURITY MODULE (CSM) INCLUDED ON THIS DEVICE WAS DESIGNED TO PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED MEMORY (EITHER ROM OR FLASH) AND IS WARRANTED BY TEXAS INSTRUMENTS (TI), IN ACCORDANCE WITH ITS STANDARD TERMS AND CONDITIONS, TO CONFORM TO TI'S PUBLISHED SPECIFICATIONS FOR THE WARRANTY PERIOD APPLICABLE FOR THIS DEVICE.
SPRS230N – OCTOBER 2003 – REVISED MAY 2012 Device Support Texas Instruments (TI) offers an extensive line of development tools for the C28x™ generation of DSPs, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
Page 90
C compiler to assist with C-callable assembly routines. SPRAA58 TMS320x281x to TMS320x280x Migration Overview describes differences between the Texas Instruments TMS320x281x and the TMS320x280x/2801x/2804x DSPs to assist in application migration. Software SPRC191 C280x, C2801x C/C++ Header Files and Peripheral Examples...
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.
Page 138
PACKAGE OPTION ADDENDUM www.ti.com 24-Sep-2012 PACKAGING INFORMATION Orderable Device Package Type Package Pins Package Qty Lead/ Samples Status Eco Plan MSL Peak Temp Drawing Ball Finish (Requires Login) TMS320C2801GGMA ACTIVE Call TI Call TI MICROSTAR TMS320C2801GGMS ACTIVE Call TI Call TI MICROSTAR TMS320C2801PZA ACTIVE...
Page 139
PACKAGE OPTION ADDENDUM www.ti.com 24-Sep-2012 Orderable Device Package Type Package Pins Package Qty Lead/ Samples Status Eco Plan MSL Peak Temp Drawing Ball Finish (Requires Login) TMS320F28016PZQ ACTIVE LQFP Green (RoHS CU NIPDAU Level-2-260C-1 YEAR & no Sb/Br) TMS320F28016PZS ACTIVE LQFP Green (RoHS CU NIPDAU Level-2-260C-1 YEAR...
Page 140
PACKAGE OPTION ADDENDUM www.ti.com 24-Sep-2012 Orderable Device Package Type Package Pins Package Qty Lead/ Samples Status Eco Plan MSL Peak Temp Drawing Ball Finish (Requires Login) TMS320F2802ZGMA ACTIVE Green (RoHS SNAGCU Level-3-260C-168 HR MICROSTAR & no Sb/Br) TMS320F2802ZGMS ACTIVE Green (RoHS SNAGCU Level-3-260C-168 HR MICROSTAR...
Page 141
PACKAGE OPTION ADDENDUM www.ti.com 24-Sep-2012 Orderable Device Package Type Package Pins Package Qty Lead/ Samples Status Eco Plan MSL Peak Temp Drawing Ball Finish (Requires Login) TMS320F2809PZA ACTIVE LQFP Green (RoHS CU NIPDAU Level-2-260C-1 YEAR & no Sb/Br) TMS320F2809PZQ ACTIVE LQFP Green (RoHS CU NIPDAU Level-2-260C-1 YEAR...
Page 142
PACKAGE OPTION ADDENDUM www.ti.com 24-Sep-2012 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Page 143
MECHANICAL DATA MPBG028B FEBRUARY 1997 – REVISED MAY 2002 GGM (S–PBGA–N100) PLASTIC BALL GRID ARRAY 10,10 7,20 TYP 9,90 0,80 0,40 A1 Corner Bottom View 0,95 0,85 1,40 MAX Seating Plane 0,55 0,10 0,08 0,45 0,45 0,35 4145257–3/C 12/01 NOTES: A. All linear dimensions are in millimeters.
Page 145
MECHANICAL DATA MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996 PZ (S-PQFP-G100) PLASTIC QUAD FLATPACK 0,27 0,50 0,08 0,17 0,13 NOM 12,00 TYP Gage Plane 14,20 13,80 0,25 16,20 0,05 MIN 0 – 7 15,80 1,45 0,75 1,35 0,45 Seating Plane 0,08 1,60 MAX 4040149 /B 11/96...
Page 147
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
Need help?
Do you have a question about the TMS320F2809 and is the answer not in the manual?
Questions and answers