Summary of Contents for Texas Instruments TMS320C6670
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TMS320C6670 Multicore Fixed and Floating-Point System-on-Chip Data Manual PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Literature Number: SPRS689D...
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Added a note on Level Interrupts and EOI values for various modules Corrected the address range for I C MMRs and corrected extended temp max to 100C from 105C SPRS689 February 2011 Initial Release For detailed revision information, see ‘‘Revision History’’ on page A-219. Release History Copyright 2012 Texas Instruments Incorporated...
– - 40°C to 100°C Copyright 2012 Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
1.2 Device Description The TMS320C6670 Communications Infrastructure KeyStone SoC is a member of the C66xx SoC family based on TI's new KeyStone Multicore SoC Architecture designed specifically for high performance wireless infrastructure applications. The C6670 provides a very high performance macro basestation platform for developing all wireless standards including WCDMA/HSPA/HSPA+, TD-SCDMA, GSM, TDD-LTE, FDD-LTE, and WiMAX.
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The C6670 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution. Copyright 2012 Texas Instruments Incorporated TMS320C6670 Features...
2.1 Device Characteristics Table 2-1 provides an overview of the TMS320C6670 SoC. The table shows the significant features of the device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count. Table 2-1...
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1 The Security Accelerator function is subject to export control and will be enabled only for approved device shipments. 2 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
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For more details on the C66x CPU and its enhancements over the C64x+ and C674x architectures, see the following documents (2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66): • C66x CPU and Instruction Set Reference Guide •...
BOOTMODE[12:0] device configuration inputs to determine the software configuration that must be completed. For more details on boot sequence see the Bootloader for the C66x DSP User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 66. Copyright 2012 Texas Instruments Incorporated Device Overview Submit Documentation Feedback...
PCI Device Configuration Field Descriptions Field Description Reserved Reserved Bar Config PCIe BAR registers configuration This value can range from 0 to 0xf. See Table 2-8. Reserved Reserved End of Table 2-7 Device Overview Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
‘‘I2C Passive Mode’’) Parameter Index Identifies the index of the configuration table initially read from the I C EEPROM. This value can range from 0 to 32. End of Table 2-9 Copyright 2012 Texas Instruments Incorporated Device Overview Submit Documentation Feedback...
0 = 16-bit address values are used 1 = 24-bit address values are used Chip Select The chip select field value Parameter Table Index Specifies which parameter table is loaded End of Table 2-11 Device Overview Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
128. For details on the operation of the PLL controller module, see the Phase Locked Loop (PLL) Controller for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page Table 2-13 C66x CorePac System PLL Configuration...
IPD/IPU. For more detailed information on pulldown/pullup resistors and IPD or IPU IPD/IPU situations in which external pulldown/pullup resistors are required, see the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66. Analog signal Type Ground Type...
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PCIe module enable (pin shared with TIMI0) Clock / Reset SYSCLKP AC29 System clock input to antenna interface and/or main PLL SYSCLKN AC28 PASSCLKP AJ18 Network coprocessor reference clock to PASS PLL PASSCLKN AH18 Device Overview Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
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DDR interface drivers to 50 Ohms. Presently, the recommended value for this 1% resistor is 45.3 Ohms. DDRDQM0 DDRDQM1 DDRDQM2 DDRDQM3 DDRDQM4 DDR EMIF data masks DDRDQM5 DDRDQM6 DDRDQM7 DDRDQM8 Copyright 2012 Texas Instruments Incorporated Device Overview Submit Documentation Feedback...
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DDR EMIF on-die termination outputs used to set termination on the SDRAMs DDRODT1 DDR reset signal DDRRESET DDRSLRATE0 Down DDR slew rate control DDRSLRATE1 Down Reference voltage input for SSTL15 buffers used by DDR EMIF (VDDS15 ÷ 2) VREFSSTL Copyright 2012 Texas Instruments Incorporated Device Overview Submit Documentation Feedback...
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These GPIO pins have secondary functions assigned to them as mentioned in the Boot GPIO08 AJ19 Down Configuration Pins section above. GPIO09 AE21 Down GPIO10 AG19 Down GPIO11 AD20 Down GPIO12 AE20 Down GPIO13 AF21 Down GPIO14 AH20 Down GPIO15 AD21 Down Device Overview Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
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JTAG clock input AD29 JTAG data input AD28 JTAG data output AC27 JTAG test mode input AC26 JTAG reset TRST AD26 Down MDIO MDIO data MDIO AG16 MDIO clock MDCLK AF16 Down Copyright 2012 Texas Instruments Incorporated Device Overview Submit Documentation Feedback...
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Ethernet MAC SGMII receive data (2 links) SGMII1RXN SGMII1RXP SGMII0TXN SGMII0TXP Ethernet MAC SGMII transmit data (2 links) SGMII1TXN SGMII1TXP SmartReflex VCNTL0 VCNTL1 Voltage control outputs to variable core power supply VCNTL2 VCNTL3 Device Overview Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
CYP), the temperature range (for example, blank is the default case temperature range), and the device speed range, in Megahertz (for example, blank is 1000 MHz [1 GHz]). For device part numbers and further ordering information for TMS320C6670 in the CYP package type, see the TI website www.ti.com...
Multicore Fixed and Floating-Point System-on-Chip SPRS689D—March 2012 www.ti.com 2.9 Related Documentation from Texas Instruments These documents describe the TMS320C6670 Multicore Fixed and Floating-Point System-on-Chip. Copies of these documents are available on the Internet at www.ti.com 64-bit Timer (Timer 64) for KeyStone Devices User Guide...
3 Device Configuration On the TMS320C6670 device, certain device configurations like boot mode and endianess, are selected at device power-on reset. The status of the peripherals (enabled/disabled) is determined after device power-on reset. By default, the peripherals on the device are disabled and need to be enabled by software before being used.
PSC usage, see the Power Sleep Controller (PSC) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 3.3 Device State Control Registers The TMS320C6670 device has a set of registers that are used to control the status of its peripherals. These registers are shown in Table 3-2.
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Device State Control Registers (Part 2 of 4) Address Start Address End Size Acronym Description 0x02620150 0x02620153 PWRSTATECTL See section 3.3.10 0x02620154 0x02620157 SRIO_SERDES_STS ‘‘Related Documentation from Texas Instruments’’ on page 66 0x02620158 0x0262015B SGMII_SERDES_STS 0x0262015C 0x0262015F PCIE_SERDES_STS 0x02620160 0x02620160 HYPERLINK_SERDES_STS 0x02620164 0x02620167 AIF2_A_SERDES_STS...
30 and see the Bootloader for the C66x DSP User Guide in2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66. LENDIAN Device endian mode (LENDIAN) — shows the status of whether the system is operating in big endian mode or little endian mode (default).
11-1 MANUFACTURER 0000 0010 111b Manufacturer This bit is read as a 1 for TMS320C6670 End of Table 3-5 The value of the VARIANT and PART NUMBER fields depend on the silicon revision being used. Note— See the Silicon Errata for details.
CorePac0 in NMI Clear 15-4 Reserved Reserved CorePac3 in Local Reset Clear CorePac2 in Local Reset Clear CorePac1 in Local Reset Clear CorePac0 in Local Reset Clear End of Table 3-7 Device Configuration Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
Used to provide a start address for execution out of the hibernation modes. See the Bootloader for the C66x DSP User Guide in2.9 ‘‘Related Documentation from Texas Instruments’’ on page HIBERNATION_MODE Indicates whether the device is in hibernation mode 1 or mode 2.
111b = Reserved LOCK Lock register fields 0 = Register fields are not locked (default) 1 = Register fields are locked until the next timer reset End of Table 3-19 Copyright 2012 Texas Instruments Incorporated Device Configuration Submit Documentation Feedback...
For more detailed information on input current (I ), and the low-level/high-level input voltages (V and V ) for the TMS320C6670 device, see Section 6.3 ‘‘Electrical Characteristics’’ on page 107. To determine which pins on the device include internal pullup/pulldown resistors, see Table 2-16 ‘‘Terminal...
4 System Interconnect On the TMS320C6670 device, the C66x CorePacs, the EDMA3 transfer controllers, and the system peripherals are interconnected through the TeraNet, which is a non-blocking switch fabric enabling fast and contention-free internal data movement. The TeraNet provides low-latency, concurrent data transfers between master peripherals and slave peripherals.
TETB (Debug_SS) CorePac_3 × TETB (core) ( 4) RAC_A_CFG TNet_3P_H MPU_4 CPU/3 RAC_B_CFG Tracer_RAC_CFG To TeraNet_3P_Tracer MPU_0 To TeraNet_3P_B Tracer_CFG n indicates the number of MPUs present in the specific device. System Interconnect Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
Control the priority level for the transactions from packet DMA master port, which access the external linking RAM. End of Table 4-4 For all other modules, see the respective User Guides in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for programmable priority registers.
2.9 ‘‘Related Documentation from Texas Instruments’’ on page 5.1 Memory Architecture Each CorePac of the TMS320C6670 device contains a 1024KB level-2 memory (L2), a 32KB level-1 program memory (L1P), and a 32KB level-1 data memory (L1D). The device also contain a 2048KB multicore shared memory (MSM).
Multicore Shared Memory Controller (MSMC) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 5.1.5 L3 Memory The L3 ROM on the device is 128KB. The ROM contains software used to boot the device. There is no requirement to block accesses from this portion to the ROM.
PRI_ALLOC have their own registers to program their priorities. More information on the bandwidth management features of the CorePac can be found in the C66x CorePac Reference Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66. Copyright 2012 Texas Instruments Incorporated C66x CorePac...
More information on the power-down features of the C66x CorePac can be found in the C66x CorePac Reference Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 5.5 CorePac Revision The version and revision of the C66x CorePac can be read from the CorePac Revision ID Register (MM_REVID) located at address 0181 2000h.
6 Overshoot/Undershoot percentage relative to I/O operating values - for example the maximum overshoot value for 1.8V LVCMOS signals is DVDD18 + 0.20 DVDD18 and × maximum undershoot value would be V - 0.20 DVDD18 Copyright 2012 Texas Instruments Incorporated Device Operating Conditions Submit Documentation Feedback...
3 SRVnom refers to the unique SmartReflex core supply voltage between 0.9 V and 1.1 V set from the factory for each individual device. 4 Where x = 1, 2, 3, 4... to indicate all supplies of the same kind. Device Operating Conditions Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
(Hi-Z) output leakage current. C uses open collector IOs and does not have a I OH Maximum. applies to output-only pins, indicating off-state (Hi-Z) output leakage current. Copyright 2012 Texas Instruments Incorporated Device Operating Conditions Submit Documentation Feedback...
1 Please note that this table does not attempt to describe all functions of all power supply terminals but only those whose purpose it is to power peripheral I/O buffers and clock input buffers. 2 Please see the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for more information about individual peripheral I/O.
7 TMS320C6670 Peripheral Information and Electrical Specifications This chapter covers the various peripherals on the TMS320C6670 device. Peripheral-specific information, timing diagrams, electrical specifications, and register memory maps are described in this chapter. 7.1 Recommended Clock and Control Signal Transition Behavior...
RESETFULL goes inactive as described below. SYSCLK1 in the following section refers to the clock that is used by the CorePac, see Figure 7-7 for more details. TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
7.2.1.1 Core-Before-IO Power Sequencing Figure 7-1 shows the power sequencing and reset control of the TMS320C6670 for device initialization. POR may be removed after the power has been stable for the required 100 μsec. RESETFULL must be held low for a period after the rising edge of POR, but may be held low for longer periods if necessary.
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• GPIO configuration bits must be held valid for at least 12 transitions of the SYSCLK1 after the rising edge of RESETFULL End of Table 7-2 TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
Figure 7-2 IO Before Core Power Sequencing Power Stabilization Phase Device Initialization Phase RESETFULL GPIO Config Bits RESET CVDD CVDD1 DVDD18 DVDD15 SYSCLK1P&N DDRCLKP&N RESETSTAT Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
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CVDD is at a valid level and that all clock inputs either be active or in a static state with one leg pulled low and the other connected to CVDD. TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated...
For recommendations on selection of power supply decoupling and bulk capacitors see the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
To guarantee maximizing performance and minimizing power consumption of the device, SmartReflex is required to be implemented whenever the TMS320C6670 device is used. The voltage selection is done using 4 VCNTL pins which are used to select the output voltage of the core voltage regulator.
For information on the Power Sleep Controller, see the Power Sleep Controller (PSC) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 7.3.1 Power Domains The device has several power domains that can be turned on for operation or off to minimize power dissipation. The global power/sleep controller (GPSC) is used to control the power gating of various power domains.
TCP3d_B Software control BCP, FFTC_C, and TCP3d_C Software control No LPSC Bootcfg, PSC, and PLL Controller These modules do not use LPSC End of Table 7-7 TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
PDCTL10 Power Domain Control Register 10 (AIF2) 0x32C PDCTL11 Power Domain Control Register 11 (TCP3d_A) 0x330 PDCTL12 Power Domain Control Register 12 (VCP2_B, VCP2_C and VCP2_D) Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
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Module Control Register 1 (SmartReflex) 0xA08 MDCTL2 Module Control Register 2 (DDR3 EMIF) 0xA0C MDCTL3 Module Control Register 3 (TCP3e) 0xA10 MDCTL4 Module Control Register 4 (VCP2_A) TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
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Module Control Register 28 (C66x CorePac3 and Timer 3) 0xA74 MDCTL29 Module Control Register 29 (TCP3d_B) 0xA78 MDCTL30 Module Control Register 30(BCP, FFTC_C and TCP3d_C) 0xA7C - 0xFFC Reserved Reserved End of Table 7-8 Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
Multicore Fixed and Floating-Point System-on-Chip SPRS689D—March 2012 www.ti.com 7.4 Reset Controller The reset controller detects the different type of resets supported on the TMS320C6670 device and manages the distribution of those resets throughout the device. The device has the following types of resets: •...
The POR pin should be held inactive (high) throughout the warm reset sequence. Otherwise, if POR Note— is activated (brought low), the minimum POR pulse width must be met. The RESET pin should not be tied to the POR pin. Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
The local reset can be used to reset a particular CorePac without resetting any other device components. Local reset is initiated by the following (for more details see the Phase Locked Loop (PLL) Controller for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66): •...
131. For more details on these registers and how to program them, see the Phase Locked Loop (PLL) Controller for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66. Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
Hold time - GPIO valid after RESETFULL asserted End of Table 7-12 1 C = 1/SYSCLK1 clock frequency in ns. Figure 7-6 Boot Configuration Timing RESETFULL GPIO[15:0] Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
‘‘Related Documentation from Texas Instruments’’ on page 66 includes a superset of features, some of which are not supported on the TMS320C6670 device. The following sections describe the registers that are supported; it should be assumed that any registers not included in these sections is not supported by the device.
SYSCLK10: 1/3-rate clock for SRIO only. • SYSCLK11: 1/6-rate clock for PSC only. Only SYSCLK2, SYSCLK5, and SYSCLK8 are programmable on the TMS320C6670 device. In case any of the other programmable SYSCLKs are set slower than 1/64 rate, then SYSCLK8 Note—...
Loop (PLL) Controller for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page Note that only registers documented here are accessible on the TMS320C6670. Other addresses CAUTION— in the PLL Controller memory map including the Reserved registers should not be modified. Furthermore, only the bits within the registers described here are supported.
0h = ÷1. Divide frequency by 1 1h = ÷2. Divide frequency by 2 2h - Fh = Reserved 18-0 Reserved Reserved End of Table 7-15 TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
1 = Align SYSCLKn to other SYSCLKs selected in ALNCTL when the GOSET bit in PLLCMD is set and SYSn in DCHANGE is 1. The SYSCLKn rate is set to the ratio programmed in the RATIO bit in PLLDIVn. End of Table 7-17 Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
End of Table 7-19 1 Where N = 1, 2, 3,..N (Not all these output clocks may be used on a specific device. For more information, see the device-specific data manual) TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated...
Power-on reset 0 = Power-on reset was not the last reset to occur 1 = Power-on reset was the last reset to occur End of Table 7-20 Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
MDCTLx[12] bit also needs to be set in the PSC to reset-isolate a particular module. For more information on the MDCTLx Register see the Power Sleep Controller (PSC) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66. The Reset Isolation register (RSTCTRL) is...
PLLM[12:0] value (round down if PLLM has an odd value) Example: If PLLM = 15, then BWADJ = 7 End of Table 7-25 TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
Transition time ALTCORECLKP rise time (250 mV) tf(ALTCORECLKP_250 mv) Transition time ALTCORECLKP fall time (250 mV) tj(ALTCORECLKN) Jitter, peak_to_peak _ periodic ALTCORECLKN tj(ALTCORECLKP) Jitter, peak_to_peak _ periodic ALTCORECLKP Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
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Transition time PCIECLKN rise time (250 mV) tf(PCIECLKN_250mv) Transition time PCIECLKN fall time (250 mV) tr(PCIECLKP_250mv) Transition time PCIECLKP rise time (250 mV) tf(PCIECLKP_250mv) Transition time PCIECLKP fall time (250 mV) TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
End of Table 7-26 1 See the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for detailed recommendations. 2 If AIF2 is being used then SYSCLK(N|P) can be programmed only to fixed values, if AIF2 is not being used then any value in the range between the min and max values can be used.
Reserved PLLM PLLD RW,+0000 1001 RW,+0 RW,+0001 RW,+0000000010011 RW,+000000 Legend: RW = Read/Write; -n = value after reset 1 This register is Reset on POR only TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
2. In DDR3PLLCTL0, write BYPASS = 1 (set the PLL in Bypass) 3. In DDR3PLLCTL1, write PLLRST = 1 (PLL is reset) 4. Program PLLM and PLLD in DDR3PLLCTL0 register Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
PASS PLL comes out in a bypass mode and needs to be programmed to a valid frequency before being enabled and used. TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
PLL supplies. Please see the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for detailed recommendations. For the best performance, TI recommends that all the PLL external components be on a single side of the board without jumpers, switches, or components other than those shown.
Two transfer controllers and two event queues with programmable system-level priority for EDMA3CC0, four transfer controllers and four event queues with programmable system-level priority for each of EDMA3CC1 and EDMA3CC2 • Interrupt generation for transfer completion and error conditions TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
VCP and TCP. For more information on these two addressing modes, see the Enhanced Direct Memory Access 3 (EDMA3) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page For the range of memory addresses that include EDMA3 channel controller (EDMA3CC) control registers and EDMA3 transfer controller (EDMA3TC) control register see Section 2.2...
For more detailed information on the EDMA3 module and how EDMA3 events are enabled, captured, processed, prioritized, linked, chained, and cleared, etc., see the Enhanced Direct Memory Access 3 (EDMA3) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page Table 7-35 EDMA3CC0 Events for C6670...
C66x CorePac. For more details on the CIC features, please see the Chip Interrupt Controller (CIC) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page Modules such as FFTC, TCP3d, TCP3e, TAC, AIF, CP_MPU, BOOT_CFG, and Tracer have level Note—...
For more information on the Interrupt Controller, see the C66x CorePac User Guide in2.9 ‘‘Related Documentation from Texas Instruments’’ on page Table 7-38 System Event Mapping — C66x CorePac Primary Interrupts (Part 1 of 4)
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QM interrupt for 256~287 queues QM_INT_LOW_9 QM interrupt for 288~319 queues QM_INT_LOW_10 QM interrupt for 320~351 queues QM_INT_LOW_11 QM interrupt for 352~383 queues QM_INT_LOW_12 QM interrupt for 384~415 queues Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
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Local GPIO interrupt GPINT9 Local GPIO interrupt GPINT10 Local GPIO interrupt GPINT11 Local GPIO interrupt GPINT12 Local GPIO interrupt GPINT13 Local GPIO interrupt GPINT14 Local GPIO interrupt TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
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Core [n] will receive TETBHFULLINTn, TETBFULLINTn, TETBACQINTn, TETBOVFLINTn and TETBUNFLINTn. Core [n] will receive SEMINTn and SEMERRn. Core [n] will receive PCIEXpress_MSI_INTn and PCIEXpress_MSI_INTn+1. Core [n] will receive MSMC_mpf_errorn. Core [n] will receive GPINTn. Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
Tracer sliding time window interrupt for QM_SS CFG TRACER_QM_SS_DMA_INTD Tracer sliding time window interrupt for QM_SS slave port TRACER_SEM_INTD Tracer sliding time window interrupt for Semaphore Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
Host Int Enable Set Index Register 0x38 HINT_ENABLE_CLR_INDEX_REG Host Int Enable Clear Index Register 0x200 RAW_STATUS_REG0 Raw Status Register 0 0x204 RAW_STATUS_REG1 Raw Status Register 1 TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
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Interrupt Channel Map Register for 60 to 60+3 0x440 CH_MAP_REG16 Interrupt Channel Map Register for 64 to 64+3 0x444 CH_MAP_REG17 Interrupt Channel Map Register for 68 to 68+3 Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
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Host Interrupt Map Register for 28 to 28+3 0x820 HINT_MAP_REG8 Host Interrupt Map Register for 32 to 32+3 0x824 HINT_MAP_REG9 Host Interrupt Map Register for 36 to 36+3 TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
De-assert local reset & NMI to all CorePacs Assert NMI to CorePac0 Assert NMI to CorePac1 Assert NMI to CorePac2 Assert NMI to CorePac3 Assert NMI to all CorePacs End of Table 7-46 Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
Pulsewidth - LRESETNMIEN low width 12*P End of Table 7-47 1 P = 1/SYSCLK1 clock frequency in ns. Figure 7-30 NMI and LRESET Timing CORESEL[3:0]/ LRESET LRESETNMIEN TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
MPU registers, see the Memory Protection Unit (MPU) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page The following tables show the configuration of each MPU and the memory regions protected by each MPU.
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(64-67) are actually used. There are two master ID values are assigned for the Queue Manager_second master port, one master ID for external linking RAM and the other one for the PDSP/MCDM accesses. Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
MPU0 R-16 R-16 MPU1 R-16 Reset Values MPU2 R-16 R-16 MPU3 R-16 MPU4 R-16 MPU5 R-16 Legend: R = Read only; -n = value after reset Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
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Assume allowed bit. When an address is not covered by any MPU protection range, this bit determines whether the transfer is assumed to be allowed or not. 0 = Assume disallowed 1 = Assume allowed TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
7.11 DDR3 Memory Controller The 64-bit DDR3 Memory Controller bus of the TMS320C6670 is used to interface to JEDEC standard-compliant DDR3 SDRAM devices. The DDR3 external bus interfaces only to DDR3 SDRAM devices; it does not share the bus with any other types of peripherals.
External components attached to this 2-wire serial bus can transmit/receive up to 8-bit data to/from the SoC through the I C module. 7.12.1 I C Device-Specific Information The TMS320C6670 device includes an I C peripheral module. NOTE: when using the I C module, ensure there are external pullup resistors on the SDA and SCL pins. The I C modules on the C6670 may be used by the DSP to control local peripheral ICs (DACs, ADCs, etc.) or may...
= total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed. Figure 7-36 C Receive Timings Stop Start Repeated Stop Start TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
= total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed. Figure 7-37 C Transmit Timings Stop Start Repeated Stop Start Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
Polarity = 0 Phase = 1 toh(SPC-SIMO) Output hold time, SPIx_SIMO valid after receive edge of SPIx_CLK except for 0.5*tc - 2 final bit. Polarity = 1 Phase = 0 TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
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Minimum inactive time on SPIx_SCS\ pin between two transfers when 2*P2 - 5 SPIx_SCS\ is not held using the CSHOLD feature. End of Table 7-69 1 P2=1/SYSCLK7 Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
7.14 HyperLink Peripheral The TMS320C6670 includes the HyperLink for companion chip/die interfaces. This is a four-lane SerDes interface designed to operate up to 12.5 Gbps per lane from pin-to-pin. The interface is used to connect with external accelerators that are manufactured using TI libraries. The Hyperbridge links must be connected with DC coupling.
<xx> represents the interface that is being used: PM or FL Figure 7-42 HyperLink Station Management Receive Timing MCMRX<xx>CLK MCMRX<xx>DAT <xx> represents the interface that is being used: PM or FL TMS320C6670 Peripheral Information and Electrical Specifications Copyright 2012 Texas Instruments Incorporated Submit Documentation Feedback...
For more information on UART, see the Universal Asynchronous Receiver/Transmitter (UART) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page Table 7-72 UART Timing Requirements...
Start 7.16 PCIe Peripheral The 2-lane PCI express (PCIe) module on TMS320C6670 provides an interface between the SoC and other PCIe-compliant devices. The PCI express module provides low pin-count, high-reliability, and high-speed data transfer at rates of 5.0 Gbps per lane on the serial links. For more information, see the Peripheral Component Interconnect Express (PCIe) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas...
2.9 ‘‘Related Documentation from Texas Instruments’’ on page 7.19 Gigabit Ethernet (GbE) Switch Subsystem The gigabit Ethernet (GbE) switch subsystem provide an efficient interface between the TMS320C6670 SoC and the networked community. The EMAC supports 10Base-T (10 Mbits/second [Mbps]), and 100BaseTX (100 Mbps), in half- or full-duplex mode, and 1000BaseT (1000 Mbps) in full-duplex mode, with hardware flow control and quality-of-service (QOS) support.
Gigabit Ethernet (GbE) Switch Subsystem for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for the register address and other details about the time synchronization module. The register CPTS_RFTCLK_SEL for reference clock selection of time synchronization...
The module is designed to allow almost transparent operation of the MDIO interface, with very little attention from the CorePac. For more information, see the Gigabit Ethernet (GbE) Switch Subsystem for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page Table 7-77 MDIO Timing Requirements...
7.21.1 Timers Device-Specific Information The TMS320C6670 device has eight 64-bit timers in total. Of which Timer0 through Timer3 are dedicated to each of the four CorePacs as a watchdog timer and can also be used as general-purpose timers. Each of other four timers can also be configured as a general-purpose timer only, with each timer programmed as a 64-bit timer or as two separate 32-bit timers.
CPU clock divided-by-3, the TCP3e is capable of processing data channels at a throughput of >200 Mbps. For more information, see the Turbo Encoder Coprocessor 3 (TCP3e) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page Copyright 2012 Texas Instruments Incorporated TMS320C6670 Peripheral Information and Electrical Specifications Submit Documentation Feedback...
7.28 General-Purpose Input/Output (GPIO) 7.28.1 GPIO Device-Specific Information On the TMS320C6670, the GPIO peripheral pins GP[15:0] are also used to latch configuration pins. For more detailed information on device/peripheral configuration and the C6670 device pin muxing, see ‘‘Device Configuration’’...
EXT FRAME EVENT 7.31 Receive Accelerator Coprocessor (RAC) The TMS320C6670 has two Receive Accelerator Coprocessor (RAC) subsystems. Each RAC subsystem is a receive chip-rate accelerator based on a generic correlator coprocessor (GCCP). It supports UMTS (Universal Mobile Telecommunications System) operations and assists in transferring data received from the antenna to the receive core and performs receive functions that target the W-CDMA macro bits.
There are three fast Fourier transform coprocessors (FFTC) intended to accelerate FFT, IFFT, DFT, and IDFT operations. For more information, see the Fast Fourier Transform Coprocessor (FFTC) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 7.34 Emulation Features and Capability 7.34.1 Advanced Event Triggering (AET) The device supports advanced event triggering (AET).
Trace works in real-time and does not impact the execution of the system. For more information on board design guidelines for trace advanced emulation, see the Emulation and Trace Headers Technical Reference in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 7.34.2.1 Trace Electrical Data/Timing Table 7-85...
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DSP's internal emulation logic will always be properly initialized when this pin is not routed out. JTAG controllers from Texas Instruments actively drive TRST high. However, some third-party JTAG controllers may not drive TRST high but expect the use of an external pullup resistor on TRST.
Added DDR3PLLCTL1 register and field description table (Page 143) Added PASSPLLCTL1 register and field descriptions (Page 146) Added the table of Power Supply to Peripheral I/O Mapping (Page 108) Marked PREDIV and POSTDIV as reserved registers (Page 131) Copyright 2012 Texas Instruments Incorporated Revision History...
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Corrected the address range for I2C MMRs (Page 196) Corrected Extended Temp max to 100C from 105C (Page 13) Added BWADJ field to DDR3PLLCTL (Page 143) Added BWADJ field to PASSPLLCTL (Page 146) Revision History Copyright 2012 Texas Instruments Incorporated...
B.2 Packaging Information The following packaging information reflects the most current released data available for the designated device(s). This data is subject to change without notice and without revision of this document. Copyright 2012 Texas Instruments Incorporated Mechanical Data Submit Documentation Feedback...
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PACKAGE OPTION ADDENDUM www.ti.com 4-Nov-2016 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples Drawing (4/5) TMS320C6670ACYP2 ACTIVE FCBGA Green (RoHS SNAGCU Level-4-245C-72HR 0 to 85 TMS320C6670CYP &...
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PACKAGE OPTION ADDENDUM www.ti.com 4-Nov-2016 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples Drawing (4/5) TMS320C6670XCYPA ACTIVE FCBGA Green (RoHS SNAGCU Level-4-245C-72HR -40 to 100 TMS320C6670XCYP & no Sb/Br) @2010 TI A1GHZ TMS320C6670XCYPA2...
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PACKAGE OPTION ADDENDUM www.ti.com 4-Nov-2016 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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