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7 Mechanical Data
7.1 Package Thermal Resistance Characteristics
Table 7-1
and
Table 7-2
the TMS320C672x DSP.
NO.
1
R
Thermal Resistance Junction to Ambient
JA
2
R
Thermal Resistance Junction to Board
JB
3
R
Thermal Resistance Junction to Top of Case
JC
4
Thermal Metric Junction to Board
JB
5
Thermal Metric Junction to Top of Case
JT
NO.
1
R
Thermal Resistance Junction to Ambient
JA
2
Thermal Metric Junction to Power Pad
JP
3
R
Thermal Resistance Junction to Ambient
JA
4
Thermal Metric Junction to Power Pad
JP
(1) PCB modeled with 2 oz/ft
(2) Package thermal pad must be properly soldered to top layer PCB thermal pad for both thermal and electrical performance. Thermal pad
is V
.
SS
(3) Top layer thermal pad is connected through via array to both bottom layer thermal pad and internal V
(4) Top layer thermal pad is connected through via array to bottom layer thermal pad.
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provide the thermal characteristics for the recommended package types used on
Table 7-1. Thermal Characteristics for GDH/ZDH Package
Two-Signal, Two-Plane, 101.5 x 114.5 x 1.6 mm , 2-oz Cu. EIA/JESD51-9 PCB
Table 7-2. Thermal Characteristics for RFP Package
Two-Signal, Two-Plane, 76.2 x 76.2 mm PCB
Double-Sided 76.2 x 76.2 mm PCB
2
Top and Bottom Cu.
TMS320C6727, TMS320C6726, TMS320C6722
Floating-Point Digital Signal Processors
SPRS268E – MAY 2005 – REVISED JANUARY 2007
THERMAL PAD CONFIGURATION
TOP
BOTTOM
(1) (2) (3)
10.6 x 10.6 mm
10.6 x 10.6 mm
7.5 x 7.5 mm
7.5 x 7.5 mm
10.6 x 10.6 mm
10.6 x 10.6 mm
(1) (2) (4)
10.6 x 10.6 mm
10.6 x 10.6 mm
10.6 x 10.6 mm
38.1 x 38.1 mm
10.6 x 10.6 mm
57.2 x 57 mm
10.6 x 10.6 mm
76.2 x 76.2 mm
10.6 x 10.6 mm
10.6 x 10.6 mm
AIR FLOW
C/W
(m/s)
25
0
14.5
0
10
0
14
0
0.39
0
AIR
C/W
FLOW
VIA
(m/s)
ARRAY
6 x 6
20
0
5 x 5
22
0
6 x 6
0.39
0
6 x 6
49
0
6 x 6
27
0
6 x 6
22
0
6 x 6
20
0
6 x 6
0.39
0
plane.
SS
Mechanical Data
107
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