Table of Contents
Advertisement
1.5
Package Dimensions
Three types of packages are available for MB90460/465 series. Figure 1.5-1 to Figure
1.5-3 show the package dimensions.
■ DIP-64P-M01 Package Dimensions
64-pin plastic SH-DIP
(DIP-64P-M01)
+0.70
4.95
–0.20
+.028
.195
–.008
+0.20
3.30
–0.30
+.008
.130
–.012
2001-2008 FUJITSU MICROELECTRONICS LIMITED D64001S-c-4-6
C
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
Figure 1.5-1 DIP-64P-M01 Package Dimensions
64-pin plastic SH-DIP
(DIP-64P-M01)
+0.22
58.00
2.283
–0.55
INDEX-1
INDEX-2
+0.40
1.778(.0700)
1.378
–0.20
+.016
(.019±.004)
.0543
–.008
Lead pitch
Package width ×
package length
Sealing method
Mounting height
Note: Pins width and pins thickness include plating thickness.
+.009
–.022
0.27±0.10
(.011±.004)
+0.50
0.47±0.10
1.00
–0
0.25(.010)
M
+.020
.039
–.0
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
CHAPTER 1 OVERVIEW
1.778mm(70mil)
17 × 58 mm
Plastic mold
5.65 mm MAX
17.00±0.25
(.669±.010)
+0.50
0.70
–0.19
+.020
.028
–.007
19.05(.750)
0~15
11
Advertisement
Table of Contents
