Thermal Specifications; Table 8. Thermal Specifications - Intel S7000FC4UR Technical Product Specification

Main Board
2.2.24

Thermal Specifications

The thermal solution designed to support the board must meet the following conditions:
Component
Processors
Processor sockets
CPU core VRDs
®
Intel 7300 Chipset MCH
IDT* 89HPES24N3A
®
Intel 82563EB Gigabit Ethernet
PHY
Enterprise Southbridge 2
ATI* RN50
Main board
30

Table 8. Thermal Specifications

Target Velocity
See Processors Thermal Specifications
500 lfm 50 °C
400 lfm 50 °C
400 lfm 50 °C
400 lfm 50 °C
400 lfm 50 °C
400 lfm 50 °C
400 lfm 50 °C
400 lfm 50 °C
Intel order number E18291-001
Intel® Server System S7000FC4UR
Target Ambient Temp Specification
100 °C, T
90°C, T
MAXIMUM
105 °C, T
105 °C, T
105 °C, T
85 °C, T
85 °C, T
100 °C, T
socket
@
sink
HIS
die
case
case
case
board