Figure 40. Applying Thermal Gap Filler - Intel D50DNP Series Integration And Service Manual

2. Using the assembled applicator (see Letter J), apply the thermal gap filler on top of the twelve center VR
components (see Letter K).
Notes:
For 4th Gen Intel® Xeon® Scalable XCC and for Intel® Xeon® CPU Max Series processor models, apply
•
248 cubic millimeters of thermal gap filler to cover the VR components with a minimum thickness of
1 mm.
For 4th Gen Intel® Xeon® Scalable MCC processor models, apply 423 cubic millimeters of thermal gap
•
filler to cover the VR components with a minimum thickness of 1.64 mm.
3. Carefully unpack the liquid-cooling loop.
4. Remove the protective covers from the PCIe* add-in card cold plate, the CPU 0 and CPU 1 cold plates.
5. Ensure that the thermal interface material (TIM) for each cold plate is in place and the plastic protective
film is removed.
Important Note: The liquid-cooling loop comes with a plastic carrier attached from the factory. The carrier is
used during the installation and removal of the liquid-cooling loop in the module. After the liquid-cooling
loop is installed in the module, the plastic carrier needs to be removed from it. Keep the plastic carrier for the
liquid-cooling loop removal, if needed in the future.
Intel® Server D50DNP Family Integration and Service Guide

Figure 40. Applying Thermal Gap Filler

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