Functional Architecture; Intel® Xeon® Processors - Intel S7000FC4UR Technical Product Specification

Main Board
The main board contains:
Chipset northbridge and southbridge components
CPU sockets
Video components
Trusted Platform Module
BIOS Flash components
Super I/O*
Seven PCI-Express* slots
Back-panel I/O connectors
Four memory riser connectors
The main board also contains many voltage regulators used by its components, as well as many
of the primary rails used by the rest of the board set. The following chapters describe the main
board in detail.
2.2

Functional Architecture

This section describes the primary functions, blocks, and components that reside on the main
board. The section is laid out as follows:
Chipset components
Primary interfaces to the memory and I/O riser
Addition information regarding other functional blocks on the board
2.2.1 Intel® Xeon® Processors
The main board supports the Quad-Core Intel
Intel Xeon Processors 7200 Series, which are based on the low-power next-generation Intel
Core™ micro-architecture. Several architectural and micro architectural enhancements have
been added to this processor, including multiple processor cores.
®
The 64-bit Intel Xeon
®
Intel Extended Memory 64 Technology (Intel
bit applications simultaneously
Next-generation Intel
Support for Enhanced Intel SpeedStep
Execute-disable bit for hardware support of security features
®
Intel Virtualization Technology
Enhanced power and thermal management
Thermal Monitor 1 (TM1): Processor thermal monitoring and throttling.
Thermal Monitor 2 (TM2) enhanced thermal management: Hardware controlled methods
to reduce power consumption.
4
®
Processor MP includes the following advanced features:
®
Core™ microarchitecture
Intel order number E18291-001
Intel® Server System S7000FC4UR TPS
® ®
Xeon Processors 7300 Series or Dual-Core
®
EM64T) for executing both 32-bit and 64-
®
Technology
®
Revision 1.0