Configuring Cooling Components - Huawei FusionModule1000B V100R003C00 Commissioning Manual

FusionModule1000B Water-Cooled IT Solution
Commissioning Guide
Local Lowest Temperature
Recorded (° C)
-20
-25
-30
-35
-40

4.5.3 Configuring Cooling Components

Prerequisites
External cooling components have been installed.
Preparations
Tools: ESD floor suction plate
Documents: cooling device layout diagram, air conditioner teamwork relationship diagram,
cooling component initial configuration table, pipe system diagram, pipe system valve control
relationship table
Skill requirement: cooling engineer
Context
Various valves are distributed in the Power Container, Equipment Container, Cooling
Container, and external pipeline of the FusionModule1000. Before operating the cooling
system, you must refer to
Table 4-9 Valve description
Name
Wafer
type
butterfly
valve
Issue 02 (2017-01-10)
For the diagrams and tables, see the initial configuration parameter manual for the solution in use.
Table 4-9
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4 Preparations for Power-On Commissioning
Glycol Solution
Concentration
40%
45%
49%
52%
55%
to understand the valves.
Power Density
Derating Coefficient
87.2%
85.5%
83.9%
82.7%
81.4%
Common Position
External pipes, Cooling
Container
13