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(1) Using a soldering iron
Complete soldering within ten seconds for lead temperatures of up to 260°C, or within three
seconds for lead temperatures of up to 350°C.
(2) Using medium infrared ray reflow
•
Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).
Figure 3 Heating top and bottom with long or medium infrared rays
•
Complete the infrared ray reflow process within 30 seconds at a package surface temperature of
between 210°C and 240°C.
•
Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.
Figure 4 Sample temperature profile for infrared or hot air reflow
(3) Using hot air reflow
•
Complete hot air reflow within 30 seconds at a package surface temperature of between 210°C
and 240°C.
•
For an example of a recommended temperature profile, refer to Figure 4 above.
(4) Using solder flow
•
Apply preheating for 60 to 120 seconds at a temperature of 150°C.
•
For lead insertion-type packages, complete solder flow within 10 seconds with the
temperature at the stopper (or, if there is no stopper, at a location more than 1.5 mm from
the body) which does not exceed 260°C.
3 General Safety Precautions and Usage Considerations
Product flow
Long infrared ray heater (preheating)
(°C)
240
210
160
140
60-120 s
Medium infrared ray heater
(reflow)
30 s
or less
Time (s)
3-13
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