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17.4.3. A.C. Specifications
Except for internal CPU core Clock frequency, the OverDrive processor will operate within the
same A.C. specifications as the Pentium Pro processor.
17.5.
THERMAL SPECIFICATIONS
This section describes the cooling solution utilized by the OverDrive processor and the cool-
ing requirements for both the processor and VRM. Heat dissipation by the OverDrive proces-
sor will be no greater than the Pentium Pro processor, as described in Chapter 14, Thermal
Specifications.
17.5.1. OverDrive
The OverDrive processor will be cooled with a fan/heatsink cooling solution. The OverDrive
processor will operate properly when the preheat temperature, T PH , is a maximum of 50ºC
(T PH is the temperature of the air entering the fan/heatsink, measured 0.3" above the center of
the fan — See Figure 17-4). When the preheat temperature requirement is met, the fan/heatsink
will keep the case temperature, T C , within the specified range, provided airflow through the
fan/heatsink is unimpeded (see Section 17.2.2.2., "Socket 8 Space Requirements").
It is strongly recommended that testing be conducted to determine if the fan inlet temperature
requirement is met at the system maximum ambient operating temperature.
The OverDrive processor will operate properly when the preheat temperature,
T PH , is a maximum of 50°C (T PH is the temperature of the air entering the
fan/heatsink, measured 0.3" above the center of the fan — See Figure 17-4).
17.5.1.1.
FAN/HEATSINK COOLING SOLUTION
A height of 0.4" airspace above the fan/heatsink unit and a distance of 0.2" around all four sides
of the OverDrive processor is REQUIRED to ensure that the airflow through the fan/heatsink is
not blocked. The fan/heatsink will reside within the boundaries of the surface of the chip. Block-
ing the airflow to the fan/heatsink reduces the cooling efficiency and decreases fan life.
Figure 17-4 illustrates an acceptable airspace clearance above the fan/heatsink and around the
OverDrive processor package.
17.5.2. OEM Processor Cooling Requirements
The OEM processor cooling solution must not impede the upgradability of the system. For
example:
OVERDRIVE® PROCESSOR SOCKET SPECIFICATION
®
Processor Cooling Requirements
NOTE
17-17
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