Page 20
4.3 Pinout Diagram - Die Form
175
DIE No. X5534D
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185
190
195
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225
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Unusable Pad
1
S1D13706
X31B-A-001-08
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155
5
10
15
20
Figure 4-3: Pinout Diagram - Die Form (S1D13706D00A)
Chip Size: 5.88 x 6.55 mm
µ
PAD size: 68 x 68
m
150
145
140
135
Y
X
(0,0)
25
30
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40
Epson Research and Development
Vancouver Design Center
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Unusable Pad
115
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100
45
50
55
Hardware Functional Specification
Issue Date: 01/11/13
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