Thermal; Figure 13. Right - Intel NUC 8 Product Specification

Intel® NUC 8 Compute Element Product Specification
3.8
The fundamental design of the Intel® NUC 8 Compute Element relies on the carrier board
enclosure for proper cooling. Both internal components and external skin temperatures are
critical parameters in proper cooling and should be considered in any design. For best cooling
performance, direct contact with a thermal management device to the bottom of the Compute
Element such as a heatsink or enclosure surface is recommended. This can be accomplished with
active or passive cooling design approaches. Non-contact convection only cooling may be
possible but will likely result in performance limitations or compromises in skin temperature
levels relative to a conductive design approach.
The Integrated Heat Spreader side of the Compute Element is the primary heat source. To
provide adequate cooling of the Compute Element while maintaining safe skin temperatures a
thermal solution that contacts the entire metal portion of the Integrated Heat Spreader is
recommended. Localized contact with the primary heat source on the Compute Element bottom
is not recommended as the location is subject to change with different generations of the
Compute Element. The Mylar side of the Compute Element does not typically require contact
with a thermal solution, however proper air flow over the top of the Compute Element is
recommended. The below information is critical for the design of a thermal solution.
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Thermal

The Thermal Design Power (TDP) of the processors used in the NUC 8 Compute Element is
15W.
The Power Limit 1 (PL1) default setting in the BIOS of the NUC 8 Compute Element is 15.
The Junction Temperature Range (T
Element is 0C -100C.
The TDP specification temperature range of the processor used in the NUC 8 Compute
Element is 35C -100C

Figure 13. Right

) of the processor used in the NUC 8 Compute
j
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