IBM 7026-H80 - RS/6000 - 256 MB RAM Service Manual page 236

Service guide
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Table 6. Service Processor Error Codes. (continued)
218
Service Guide
Error Code Description
4066 31FF Scan interface basic assurance tests
detected RIO port fault
4066 3200 Scan interface basic assurance tests
detected primary I/O drawer fault
4066 3201 Scan interface basic assurance tests
detected primary I/O backplane fault
4066 3280 Scan interface basic assurance tests
detected primary RIO adapter fault
4066 3281 Scan interface basic assurance tests
detected primary RIO port 0 fault
4066 3282 Scan interface basic assurance tests
detected primary RIO port 1 fault
4066 3283 Scan interface basic assurance tests
detected primary RIO ports fault
4066 3284 Scan interface basic assurance tests
detected PCI controller PHB0 fault
4066 3285 Scan interface basic assurance tests
detected PCI controller PHB1 fault
4066 3286 Scan interface basic assurance tests
detected PCI controller PHB2 fault
4067 0001 6xx bus processor runtime
diagnostics detected CEC backplane
fault
4067 0003 6xx bus processor runtime
diagnostics detected processor fault
4067 0009 6xx bus processor runtime
diagnostics detected memory fault
Action/
Possible Failing FRU
Processor card
Location: U1.1-P1-C1
Go to "MAP 1540: Minimum
Configuration" on page 113.
Primary I/O backplane
Location: U0.1-P1
Primary RIO adapter
Location: U0.1-P1.1
1. Check RIO cable
Location: U0.1-P1.1/Q1
2. Primary RIO adapter
Location: U0.1-P1.1
1. Check RIO cable
Location: U0.1-P1.1/Q2
2. Primary RIO adapter
Location: U0.1-P1.1
Primary RIO adapter
Location: U0.1-P1.1
1. RIO adapter
Location: U0.1-P1.1
2. Primary I/O backplane
Location: U0.1-P1
1. RIO adapter
Location: U0.1-P1.1
2. Primary I/O backplane
Location: U0.1-P1
1. RIO adapter
Location: U0.1-P1.1
2. Primary I/O backplane
Location: U0.1-P1
CEC backplane
Location: U1.1-P1
All processors
Location: U1.1-P1-C1
All memory
Locations:
U1.1-P1-C1
U1.1-P1-M1
U1.1-P1-M2.
Go to "MAP 1540: Minimum
Configuration" on page 113 and run
CEC drawer minimum configuration
to isolate the failing memory
component.

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