Mechanical Data; Thermal Data; Packaging Information - Texas Instruments TMS320C6474 Manual

www.ti.com

8 Mechanical Data

8.1

Thermal Data

Table 8-1 shows the thermal resistance characteristics for the PBGA—CUN/GUN/ZUN—mechanical
package.
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [CUN/GUN/ZUN]
NO.
1 RΘ Junction-to-case
JC
2 RΘ Junction-to-board
JB
(1) A heatsink is required for proper device operation.
(2) m/s = meters per second
8.2

Packaging Information

The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2008–2010, Texas Instruments Incorporated
PARAMETER
Submit Documentation Feedback
Product Folder Link(s) :TMS320C6474
TMS320C6474
SPRS552F – OCTOBER 2008 – REVISED JULY 2010
(1)
°C/W
0.30
6.5
Mechanical Data
AIR FLOW
(2)
(m/s)
N/A
N/A
207