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Double-Pulse Test System Si/SiC Test Fixture
Installation and Use Guide
C
Installing Surface-Mount Devices
For surface-mount devices, such as the D
DUT Module or custom surface-mount gate resistors on the PD1000-66540 or
PD1000-66541 Gate Drive Modules, a standard small-tipped soldering iron may
be used. However, you may find it easier to use a hot air solder reflow tool.
For the custom Gate Drive resistors, use the correct size of SMD resistors.
Because of the tight spacing and small size of the resistors, it is best to use a hot
air type reflow solder tool and push the SMD resistors in place. Gate Drive
Resistors, RG1 and RG2, must be equal values. RG1 is an Imperial size 1206 (L =
1.2 mm, W = 0.6 mm) RG2 is an imperial size 0603 (L = 0.6 mm, W = 0.3 mm).
Use Anti-static procedures when soldering the devices to the Test Module.
Using a Hot Air Solder Reflow Tool
1 Start by applying flux to the pads on the test module. The flux cleans the pad
and makes it easier for the solder to adhere properly.
2 Apply a small amount of solder paste on the all the pads of the component
you want to solder.
3 Using bent-nose tweezers or pointed probe, place the component in its
correct position and hold it there.
These Keysight printed circuit assemblies (PCAs) are RoHS
compliant. To ensure a reliable connection when installing
surface mount devices or custom gate resistors, you must use a
lead-free soldering process.
For detailed information on soldering devices to the printed circuit
assembly, refer to the latest IPC 610 standard.
Do not use solder paste that contains a toxic substance (lead).
Use extreme caution when handling and using the paste. Follow
all manufacturers warning and guidelines.
All soldering involves temperatures that may exceed 500 ° C.
These temperatures may burn skin, eyes, clothing, etc. Always
use eye protection when soldering.
2
PAK transistors on the PD1000-62401
75
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