Specifications; Feature List; Table 3 Feature Summary - Congatec COM Express conga-TR3 User Manual

3rd generation amd embedded r-series soc
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2

Specifications

2.1

Feature List

Table 3
Feature Summary
Form Factor
SoC
Memory
Chipset
Audio
Ethernet
Graphics Options
Peripheral
Interfaces
BIOS
Security
Power
Management
cBC
Note
Some of the features mentioned in the above Feature Summary are optional. Check the article number of your module and compare it to the
option information list on page 11 of this user's guide to determine what options are available on your particular module.
Copyright © 2016 congatec AG
Based on COM Express™ standard pinout Type 6 (Basic size 95 x 125mm). Compliant with COM Express 2.1 specification.
3rd Generation AMD Embedded R-Series (FP4) SoC, with TDP ranging from 12-35W
SO-DIMM DDR4 up to 2133 MT/s. Supports up to 32GB with 2x 16GB SO-DIMM modules (ECC and non-ECC). Sockets located top and bottom side
of module.
Integrated in the SoC
High Definition Audio (HDA) interface
1 Gigabit Ethernet support via the onboard Intel
AMD Radeon 3rd Generation GCN, Unified Video Decoder 6 (4K H.265 and H.264), Video Compression Engine 3.1 (4K H.264 encode), OpenGL 4.4,
OpenCL
®
2.0, DirectX
®
12, full HSA support, up to three independent displays.
LVDS (Integrated flat panel interface with 25-112MHz single/dual-channel
Transmitter). Supports:
-
Single-channel LVDS interface: 1 x 18 bpp or 1 x 24 bpp.
-
Dual-channel LVDS interface : 2 x 18 bpp or 2 x 24 bpp.
-
VESA standard or JEIDA data mapping
-
Automatic Panel Detection via Embedded Panel Interface based on VESA
EDID™ 1.3.
-
Resolution up to 1920x1200 in dual channel LVDS mode.
Optional eDP interface (assembly option)
NOTE: Either eDP or LVDS signals supported. Both not supported.
2 Serial ATA
(6 Gb/s)
®
3 PCI Express
3.0 ports (8 GT/s).
®
4 USB 2.0
4 USB 3.0/2.0
2 UART
2 ExpressCard
AMI Aptio
UEFI 5.x firmware; 8 MByte serial SPI with congatec Embedded BIOS features
®
Optional TPM 1.2/2.0
ACPI 5.0 compliant with battery support. Also supports Suspend to RAM (S3).
Multi-stage watchdog, manufacturing and board information, board statistics, I2C bus, Power loss control.
®
Ethernet Controller i211.
TR33m10
1 PEG Gen 3 port (x8 lanes) for external graphics.
2 dedicated DDIs (Digital Display Interfaces) with support for
-
2 DisplayPort 1.2 (resolution up to 4k @ 60Hz).
-
2 HDMI 2.0 port (requires external level shifter)
-
2 DVI port (requires external level shifter).
1 Optional DDI (assembly option)
NOTE: To support HDMI/DVI, an external level shifter (e.g PTN
3360D) needs to be implemented on the user's carrier board.
LPC Bus
SDIO interface (shared with GPIOs
I²C Bus, Fast Mode, multimaster
SM Bus
SPI
12/105

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