Heatspreader Dimensions - Congatec COM Express conga-TR3 User Manual

3rd generation amd embedded r-series soc

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4.3

Heatspreader Dimensions

The heatspreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some

modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers.

Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered

as a heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution. The application

specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions

may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.

Note

The gap pad material used on all heatspreaders contains silicon oil that can seep out over time depending on the environmental conditions

it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap pad material

manufacturer's specification.

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