In no event shall congatec AG be liable for any incidental, consequential, special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information...
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Trademarks Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.
(c) arising from course of performance, course of dealing, or usage of trade. congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause.
Technical Support congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities and drivers, which have been made available to assist you.
The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to 4 of the USB 2.0 ports can support SuperSpeed USB. The conga-TS170 modules use the Type 6 pinout definition and comply with COM Express 2.1 specification. They are equipped with two high performance connectors that ensure stable data throughput.
Options Information The conga-TS170 is currently available in thirteen variants. The table below shows the different configurations available. Check for the part number that applies to your product. This will tell you what options described in this user’s guide are available on your particular module.
Intel 6th Generation Core i7,i5,i3 Celeron and Xeon mobile processors. Memory Two memory sockets (located on the top and bottom side of the conga-TS170). Supports SO-DIMM DDR4 (voltage @ 1.2V) modules Data rates up to 2133 MT/s Maximum 32 GB capacity (2x16 GB)
Some of the features mentioned in the above feature summary are optional. Check the article number of your module and compare it to the option information list on page 11 of this user’s guide to determine what options are available on your particular module. Supported Operating Systems The conga-TS170 supports the following operating systems. • Microsoft ®...
Power Consumption The power consumption values were measured with the following setup: • conga-TS170 COM • modified congatec carrier board • conga-TS170 cooling solution • Microsoft Windows 7 (64 bit) Note The CPU was stressed to its maximum workload with the Intel Thermal Analysis Tool ®...
Table 5 Power Consumption Values The tables below provide additional information about the power consumption data for each of the conga-TS170 variants offered. The values are recorded at various operating mode. Part Memory BIOS Current (Amp.) Size Rev. Rev. (64 bit)
Storage: 5% to 95% Caution The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating temperature refers to any measurable spot on the heatspreader’s surface. Humidity specifications are for non-condensing conditions.
Cooling Solutions congatec AG offers three cooling solutions for the conga-TS170: • Active cooling solution (CSA) • Passive cooling solution (CSP) • Heatspreader The dimensions of the cooling solutions are shown below and all measurements are in millimeter. The maximum torque specification for heatspreader screws is 0.3 Nm.
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The gap pad material used on all heatspreaders contains silicon oil that can seep out over time depending on the environmental conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap pad material manufacturer’s specification.
Heatspreader Thermal Imagery The conga-TS170 heatspreader solution features heat pipes. A heat pipe is a simple device that can quickly transfer heat from one point to another. They are often referred to as the “superconductors” of heat as they possess an extra ordinary heat transfer capacity and rate with almost no heat loss.
Onboard Temperature Sensors The conga-TS170 features two sensors on the top side of the module and two optional DRAM sensors (build-time) on the top and bottom side of the module. Top-Side (CPU Temperature & Board Temperature Sensor) : The CPU temperature sensor (T00) is located in the CPU (U1). This sensor measures the CPU temperature and is defined in CGOS API as CGOS_TEMP_CPU.
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Bottom-Side (Optional DRAM Sensor): The conga-TS170 offers an optional sensor on the bottom side of the module. This sensor measures the temperature of the DRAM module and is defined in CGOS API as CGOS_TEMP_BOTDIMM_ENV. The DRAM sensor location is shown below:...
Connector Rows The conga-TS170 is connected to the carrier board via two 220-pin connectors (COM Express Type 6 pinout) for a total of 440 pins connectivity. These connectors are broken down into four rows. The primary connector consists of rows A and B while the secondary connector consists of rows C and D.
6.1.7 PCI Express™ The conga-TS170 offers six PCI Express™ lanes on the A-B connector and two lanes on the CD connector. The lanes are based on PCI Express Specification 3.0 with up to 8 GT/s (Gen 3) speed. Default configuration for the PCIe lanes on the conga-TS170 is 8 x1 links. Other combinations are possible but would require a special/ customized BIOS firmware.
6.1.8 ExpressCard™ The conga-TS170 supports the implementation of ExpressCards, which requires the dedication of one USB 2.0 port or a x1 PCI Express link for each ExpressCard used. 6.1.9 The Intel ® 6th Generation processor does not natively support VGA interface. The conga-TS170 however offers the VGA interface via an eDP to VGA converter, connected to the upper two data lanes on the embedded DisplayPort.
Note The UART interfaces do not support legacy COM port emulation. 6.1.12 GPIOs The conga-TS170 offers General Purpose Input/Output signals on the AB connector. The GPIO signals are controlled by the congatec Board controller. 6.1.13 Power Control PWR_OK Power OK from main power supply or carrier board voltage regulator circuitry.
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0.8V when the 12V is applied to the module. Actively driving PWR_OK high is compliant to the COM Express specification but this can cause back driving. Therefore, congatec recommends driving the PWR_OK low to keep the module in reset and tri-state PWR_OK when the carrier board hardware is ready to boot.
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With this solution, it must be ensured that by the time the 3.3V is up, all carrier board hardware is fully powered and all clocks are stable. The conga-TS170 provides support for controlling ATX-style power supplies. When not using an ATX power supply then the conga-TS170’s pins SUS_S3/PS_ON, 5V_SB, and PWRBTN# should be left unconnected.
6.1.14 Power Management ACPI The conga-TS170 supports Advanced Configuration and Power Interface (ACPI) specification, revision 5.0. It also supports Suspend to RAM (S3). For more information, see section 7.3 “ACPI Suspend Modes and Resume Events”. DEEP Sx The Deep Sx is a lower power state employed to minimize the power consumption while in S3/S4/S5. In the Deep Sx state, the system entry condition determines if the system context is maintained or not.
PCI Express™ The conga-TS170 offers 6 lanes on the AB connector and 2 lanes on the CD connector. The PCI Express interface is based on the PCI Express Specification 3.0 with Gen 1 (2.5 Gb/s), Gen 2 (5 Gb/s) and Gen 3 (8 Gb/s) speeds.
6.2.3 Digital Display Interface The conga-TS170 supports up to three Digital Display Interfaces (digital ports B,C & D). Each interface can be configured as DisplayPort, HDMI/ DVI and also supports dual mode (DP++). Any display combination is supported. The table below shows the supported conga-TS170 display combinations and resolutions.
6.2.3.1 HDMI The conga-TS170 offers three HDMI ports on the CD connector via the Digital Display Interfaces. The HDMI interfaces are based on HDMI 1.4 specification with support for 3D, 4Kx2K@24Hz, Deep Color. Supported audio formats are AC-3 Dolby Digital, Dolby Digital Plus, DTS-HD, LPCM, 192 kHz/24 bit, 8 channel, Dolby TrueHD, DTS-HD Master Audio (Lossless Blu-Ray Disc Audio Format).
6.2.4 USB 3.0 The conga-TS170 offers four SuperSpeed USB 3.0 ports on the CD connector. These ports are controlled by the xHCI host controller provided by the Intel 100 Series PCH . The host controller allows data transfers of up to 5 Gb/s and supports SuperSpeed, High-Speed, Full-Speed and ®...
I²C bus from the x86 core architecture, which results in higher embedded feature performance and more reliability, even when the x86 processor is in a low power mode. It also ensures that the congatec embedded feature set is fully compatible amongst all congatec modules.
OEM POST Logo This feature allows system designers to replace the congatec POST logo displayed in the upper left corner of the screen during BIOS POST with their own BIOS POST logo. Use the congatec system utility CGUTIL 1.5.4 or later to replace/add the OEM POST logo.
The architecture of the CGOS API driver provides the ability to write application software that runs unmodified on all congatec CPU modules. All the hardware related code is contained within the congatec embedded BIOS on the module. See section 1.1 of the CGOS API software developers guide, which is available on the congatec website .
Security Features The conga-TS170 can be equipped optionally with a “Trusted Platform Module“ (TPM 1.2/2.0). (not available with an internal TPM platform module), however there is software support for an external TPM by the BIOS. This TPM 1.2/2.0 includes coprocessors to calculate efficient hash and RSA algorithms with key lengths up to 2,048 bits as well as a real random number generator.
Tech Notes The conga-TS170 has some technological features that require additional explanation. The following section will give the reader a better understanding of some of these features. This information will also help to gain a better understanding of the information found in the System Resources section of this user’s guide as well as some of the setup nodes found in the BIOS Setup Program description section.
® Turbo Boost 2 Technology visit the Intel ® website. Note Only conga-TS170 module variants that feature the Xeon, Core™ i7 and i5 processors support Intel ® Turbo Boost 2 Technology. Refer to the power consumption tables in section 2.5 of this document for information about the maximum turbo frequency available for each variant of the conga-TS170.
2. In order for THERMTRIP# to automatically switch off the system, use an ATX style power supply. 8.2.3 Processor Performance Control Intel processors found on the conga-TS170 run at different voltage/frequency states (performance states), which is referred to as Enhanced ® Intel ®...
CPU by the application. The conga-TS170 supports Critical Trip Point. This cooling policy ensures that the operating system shuts down properly if the temperature in the thermal zone reaches a critical point, in order to prevent damage to the system as a result of high temperatures. Use the “critical trip point”...
DDR4 Memory The Intel 6th Generaation Processor featured on the conga-TS170 supports DDR4 memory modules up to 2133 MT/s. The DDR4 memory modules have lower voltage requirements with higher data rate transfer speeds. They operate at a voltage of 1.2V. With this low voltage system memory interface on the processor, the conga-TS170 offers a system optimized for lowest possible power consumption.
Signal Descriptions and Pinout Tables The following section describes the signals found on COM Express™ Type VI connectors used for congatec AG modules. The pinout of the modules complies with COM Express Type 6 Rev. 2.1. Table 3 describes the terminology used in this section for the Signal Description tables. The PU/PD column indicates if a COM Express™...
The GBE0_LINK# output is only active during a 100Mbit or 1Gbit connection, it is not active during a 10Mbit connection. This is a limitation of Ethernet controller since it only has 3 LED outputs, ACT#, LINK100# and LINK1000#. The GBE0_LINK# signal is a logic AND of the GBE0_LINK100# and GBE0_LINK1000# signals on the conga-TS170 module. Table 12 Serial ATA Signal Descriptions...
Type 2-6 TYPE2# TYPE1# TYPE0# Pinout standard. Pinout Type 1 The conga-TS170 is based Pinout Type 2 on the COM Express Type Pinout Type 3 (no IDE) 6 pinout therefore the pins Pinout Type 4 (no PCI) 0 and 1 are not connected...
On the conga-TS170 the PCIExpress Bus acts as the subtractive decoding agent. All I/O cycles that are not positively decoded are forwarded to the PCI Bus not the LPC Bus. Only specified I/O ranges are forwarded to the LPC Bus. In the congatec Embedded BIOS the following I/O address ranges are sent to the LPC Bus: 2Eh –...
4. Internal PCI devices not connected to the conga-TS170 are not listed. 10.3 There are no onboard resources connected to the I²C bus. Address 16h is reserved for congatec Battery Management solutions. 10.4 SM Bus System Management (SM) bus signals are connected to the Intel®...
POST allowing the operator to select either the boot device that should be used or an option to enter the BIOS setup program. 11.2 Setup Menu and Navigation The congatec BIOS setup screen is composed of the menu bar and two main frames. The menu bar is shown below: Main Advanced Chipset...
Serial Number No option Displays the serial number of the board. BC Firmware Revision No option Displays the congatec board controller firmware revision. MAC Address (1st Ethernet) No option Displays the MAC address of the onboard i218 Ethernet controller. Boot Counter No option Displays the number of boot-ups (maximum 16777215).
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LVDS panel. Auto detection is performed by reading an EDID™ data set via the VGA 640x480 1x18 (013h) video I²C bus. The number in brackets specifies the congatec internal number of the respective WVGA 800x480 1x18 (01Fh) panel data set.
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Select delay to adjust LVDS panel timings. 100ms Delay Note: The congatec board controller will add the delay to the backlight signal coming from the 250ms Delay SoC according this setup node. This feature may help to avoid panel flickering.
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Note In ACPI mode, the “Watchdog ACPI Event” handler cannot directly restart or shutdown the OS. The congatec BIOS will perform one of the following actions instead: • Shutdown: An over temperature notification is executed. This causes the operating system to shut down in an orderly fashion.
SparkFun device is 0xE2(226). However, any even device address can be specified. BC Diagnostics Console Settings BC Diagnostics Disabled Select the interface to be used for the congatec Board Controller Diagnostic Console output or Console Interface BC AUX Port disable the diagnostic output. BC COM Port 0...
BIOS setup program will not launch. The congatec BIOS uses a SHA256 based encryption for the password, which is more secured than the original AMI encryption. The BIOS password is case sensitive with a minimum of 3 characters and a maximum of 20 characters. Once a BIOS password has been assigned, the BIOS activates the grayed out ‘BIOS Update and Write Protection’...
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Only the congatec utility interface to the SMI handler of the BIOS flash update is enabled. Other interfaces to the SMI handler are disabled to prevent non congatec tools from writing to the BIOS flash. As a result of this restriction, flash utilities supplied by AMI or Intel will not work .
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Note 1. The term ‘AC power loss’ stands for the state when the module looses the standby voltage on the 5V_SB pins. On congatec modules, the standby voltage is continuously monitored after the system is turned off. If the standby voltage is not detected within 30 seconds, this is considered an AC power loss condition.
Additional BIOS Features The conga-TS170 uses a congatec/AMI AptioEFI that is stored in an onboard Flash Rom chip and can be updated using the congatec System Utility, which is available in a DOS based command line, Win32 command line, Win32 GUI, and Linux version.
Industry Specifications The list below provides links to industry specifications that apply to congatec AG modules. Specification Link Low Pin Count Interface Specification, Revision 1.0 (LPC) http://developer.intel.com/design/chipsets/industry/lpc.htm Universal Serial Bus (USB) Specification, Revision 2.0 http://www.usb.org/home PCI Specification, Revision 2.3 http://www.pcisig.com/specifications Serial ATA Specification, Revision 3.0...
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