Specifications; Feature List; Table 3 Feature Summary - Congatec COM Express conga-TC175 User Manual

2

Specifications

2.1

Feature List

Table 3 Feature Summary
Form Factor
Processor
Memory
congatec Board
Controller
Chipset
Audio
Ethernet
Graphics
Options
Peripheral
Interfaces
BIOS
Storage
Copyright © 2017 congatec AG
Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Compact size 95 x 95 mm)
7 th Generation Intel ® Core™ i7,i5, i3 Single Chip Ultra Low TDP Processors
Two memory sockets (located on the top and bottom side of the conga-TC175). Supports
SO-DIMM non-ECC DDR4 modules
-
Data rates up to 2133 MT/s
-
Maximum 32 GB capacity (16 GB each)
-
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I2C bus,
Power loss control
Intel 100 Series PCH-LP integrated in the Multi-Chip Package
®
High Definition Audio interface with support for multiple codecs
Gigabit Ethernet (Intel i219-LM controller) with support for AMT 11
®
Next Generation Intel HD (610/620). Supports:
®
API (DirectX 12, OpenGL 5.0, OpenCL 2.1)
-
Intel ® QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-
Switchable/Hybrid graphics
-
Up to 3 independent displays (must be two DDI's (DP, HDMI/DVI) and one eDP/LVDS)
-
1x LVDS
Up to 2x DDIs with support for:
2x DisplayPort++ (DisplayPort 1.2)
-
2x HDMI 1.4a or HDMI 2.0
*1 *1 *2
-
2x DVI port
*1
-
Resolutions up to 4K
-
USB Interfaces:
Up to 8x USB 2.0
-
Up to 4x USB 3.0
-
Buses
LPC
-
I²C (fast mode, multi-master)
-
SMB
-
SPI
-
3x SATA ® (6Gb/s with RAID 0/1/5 support)
AMI Aptio UEFI 5.x firmware, 8 or 16 MByte serial SPI with congatec Embedded BIOS features.
®
Optional eMMC 5.0 onboard flash
Optional Interface (assembly options):
1x eDP 1.4
-
1x VGA *3
-
NOTE:
Requires an external level shifter on the carrier board.
*1
Requires a Level Shifter Protocol Converter (LSPCON) on the carrier board.
*2
Display combination with this option is 1x DDI, 1x VGA and 1x LVDS/eDP
*3
Up to 8x PCI Express Gen. 3 lanes
®
2x UART
GPIOs
Optional PEG port (x1 or x2)
*2
NOTE:
Intel Chipset supports only 6 PCIe devices at any time.
*1
Requires re-routing of PCIe lanes 5 or 6 or both (assembly option)
*2
Seven PCIe lanes if x1 PEG port is implemented or 6 PCIe lanes if x2 PEG
*3
port is implemented.
TCKLm10
*1 *3
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