Assembly Overview Of The Intel Reference Thermal Mechanical Design; Exploded View Of Cek Thermal Solution Components - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Thermal/mechanical design guidelines

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2.4.4

Assembly Overview of the Intel Reference Thermal

Mechanical Design

The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5300

Series thermal performance targets are called the Common Enabling Kit (CEK)

heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the

following components:

• Heatsink (with captive standoff and screws)

• Thermal Interface Material (TIM)

• CEK Spring

2.4.4.1

Geometric Envelope

The baseboard keepout zones on the primary and secondary sides and height

restrictions under the enabling component region are shown in detail in

The overall volumetric keep in zone encapsulates the processor, socket, and the entire

thermal/mechanical enabling solution.

2.4.4.2

Assembly Drawing

Figure 2-16. Exploded View of CEK Thermal Solution Components

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

Thermal/Mechanical Reference Design

Appendix

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