Ilm Keying; Ilm Back Plate Design Overview; Ilm Back Plate - Intel BX80619I73820 Design Manual

Independent Loading Mechanism (ILM)
4.2.2.1

ILM Keying

As indicated in
degree rotation of ILM assembly with respect to socket. This result in a specific
orientation with respect to ILM active lever and pin 1 of the socket body.
Figure 4-8.

ILM Keying

4.2.3

ILM Back Plate Design Overview

The back plate consists of a flat steel back plate with threaded studs to attach to the
ILM frame. A clearance hole is located at the center of the plate to allow access to test
points and backside capacitors. Two additional cut-outs on the backplate provide
clearance for backside voltage regulator components. An insulator is pre applied by the
vendor to the side with the threaded studs.
Note: The ILM Back Plate is designed to work with board thicknesses from 0.062 inches to
0.100 inches. If the board is outside of this range, the backplate will require
modification.
Figure 4-9.

ILM Back Plate

Thermal/Mechanical Specifications and Design Guide
Figure 4-8, the socket protrusion and ILM key features prevent 180-
If the ILM is attempted to be
installed 180° out of phase, the
ILM frame will interfere with ILM frame will interfere with
socket protrusion
ILM keying feature molded in ILM keying feature molded in
socket body and corresponding
ILM key feature in the frame.
Clearance cutouts (3x)
6-32 Threaded Studs (4x)
33