Ilm Cover Assembly; Back Plate - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

When closed, the load plate applies two point loads onto the IHS at the "dimpled"
features shown in
transmitted to the hinge frame assembly and through the fasteners to the back plate.
Some of the load is passed through the socket body to the board inducing a slight
compression on the solder joints.
A pin 1 indicator will be marked on the ILM cover assembly.
Figure 4-1.

ILM Cover Assembly

4.1.2 ILM Back Plate Design Overview
The back plate (see
features for ILM attach. A clearance hole is located at the center of the plate to allow
access to test points and backside capacitors if required. An insulator is pre-applied. A
notch is placed in one corner to assist in orienting the back plate during assembly.
Note: The Server ILM back plate is different from the Desktop design. Since Server
secondary-side clearance of 3.0 mm[0.118 inch] is generally available for leads and
backside components, so Server ILM back plate is designed with 1.8 mm thickness and
2.2 mm entire height including punch protrusion length.
Figure 4-2.

Back Plate

30
Figure 4-1. The reaction force from closing the load plate is
Hinge / Hinge /
Frame Frame
Assy Assy
Load Load
Plate Plate
Pin 1 Indicator Pin 1 Indicator
Shoulder Screw Shoulder Screw
Figure 4-2) is a flat steel back plate with pierced and extruded
Assembly Assembly
Orientation Orientation
Feature Feature
Pierced & Extruded Pierced & Extruded
Thread Features Thread Features
Independent Loading Mechanism (ILM)
Fasteners Fasteners
Die Cut Die Cut
Insulator Insulator
Thermal/Mechanical Specifications and Design Guidelines
Load Load
Lever Lever