Balanced Technology Extended (Btx) Thermal/Mechanical Design Information; Overview Of The Btx Reference Design; Target Heatsink Performance - Intel E6700 - Core 2 Duo Dual-Core Processor Design Manual

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

5 Balanced Technology Extended
(BTX) Thermal/Mechanical
Design Information
5.1

Overview of the BTX Reference Design

The reference thermal module assembly is a Type II BTX compliant design and is
compliant with the reference BTX motherboard keep-out and height recommendations
defined in Section 6.6.
The solution comes as an integrated assembly. An isometric view of the assembly is
provided in Figure 5-4.
5.1.1

Target Heatsink Performance

Table 5–1 provides the target heatsink performance for the processor with the BTX
boundary conditions. The results will be evaluated using the test procedure described
in Section 5.2.
The table also includes a T
solution at the processor fan heatsink inlet discussed in Section 3.3. The analysis
assumes a uniform 35 °C external ambient temperature to the chassis of across the
fan inlet, resulting in a temperature rise, T
maximize processor performance (refer to Sections 2.2, 2.4. and Chapter 4).
Minimizing T
Table 5–1. Balanced Technology Extended (BTX) Type II Reference TMA Performance
Intel Core™2 Duo processor E8000
series with 6 MB cache
Intel Core™2 Duo processor E7000
series with 3 MB cache /Intel Pentium
dual-core processor E6000, E5000 series
with 2 MB cache / Intel
processor E3000 series with 1 MB cache
NOTES:
1.
2.
3.
Thermal and Mechanical Design Guidelines
assumption of 35.5 °C for the Intel reference thermal
A
can lead to improved acoustics.
R
Processor
® ®
Celeron
Performance targets (Ψ ca) as measured with a live processor at TDP.
The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with
6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium
dual-core processor E6000, E5000 series with 2 MB cache, and Intel
processor E3000 series is due to a slight difference in the die size.
This data is pre-silicon data, and subject to change with the post silicon validate
results.
, of 0.5 °C. Meeting T
R
Thermal
Requirements,
Ψca
(Mean + 3σ)
0.57 °C/W
®
0.594 °C/W
and Ψ targets can
A CA
T
Notes
A
Assumption
35.5 °C 1,2,3
35.5 °C 1,2,3
®
® ®
Celeron
39