Ilm Back Plate Design Overview; Ilm Cover Assembly; Back Plate - Intel Core i7-800 Specifications

Desktop processor series and lga1156 socket thermal/mechanical specifications and design guidelines
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When closed, the load plate applies two point loads onto the IHS at the "dimpled"
features shown in
transmitted to the hinge frame assembly and through the fasteners to the back plate.
Some of the load is passed through the socket body to the board inducing a slight
compression on the solder joints.
A pin 1 indicator will be marked on the ILM cover assembly.
Figure 4-1.

ILM Cover Assembly

4.1.2

ILM Back Plate Design Overview

The back plate (see
features for ILM attach. A clearance hole is located at the center of the plate to allow
access to test points and backside capacitors if required. An insulator is pre-applied. A
notch is placed in one corner to assist in orienting the back plate during assembly.
Figure 4-2.

Back Plate

26
Figure
4-1. The reaction force from closing the load plate is
Hinge /
Hinge /
Frame
Frame
Assy
Assy
Load
Load
Plate
Plate
Pin 1 Indicator
Pin 1 Indicator
Shoulder Screw
Shoulder Screw
Figure
4-2) is a flat steel back plate with pierced and extruded
Assembly
Assembly
Orientation
Orientation
Feature
Feature
Pierced & Extruded
Pierced & Extruded
Thread Features
Thread Features
Independent Loading Mechanism (ILM)
Fasteners
Fasteners
Die Cut
Die Cut
Insulator
Insulator
Thermal/Mechanical Specifications and Design Guidelines
Load
Load
Lever
Lever

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