Intel 852GME Design Manual page 240

Platform Design Checklist
Pin Name
BOOTSELEC
T
OPTIMIZED/C
OMPAT#
PWRGOOD
RESET#
SLP#
SMI#
STPCLK#
TESTHI[5:0],
TESTHI[10:8]
THERMTRIP#
VCC[85:0]
VCCA, VSSA,
VCCIOPLL
VCCSENSE,
VSSSENSE
VSS[182:0]
NOTE: Default tolerance for resistors is ± 5% unless otherwise specified.
240
System
Termination
Pull-up/Pull-down
300 pull-up to
VCC
51 pull-up to VCC 150
pull-up to
If USING
ITP700FLEX
ITP700FLEX
56 pull up to VCC
56 pull-up to VCC
Connect to VCC
Connect to VCC via
filter
Connect to test vias
Connect to gnd
® ®
Intel 852GME, Intel 852GMV and Intel
Series Voltage
Translation
with the PROCHOT# signal.
See Figure 110.
Connects to CPU VR module. This
pin will shift load line depends on
Processor. Please refer to IMVP-5
specification for more information.
Please refer to Processor Datasheet
for resistor recommendation.
Point-to-point connection to ICH4-M,
with resistor placed by the
processor.
from If ITP700FLEX is Not Used: Point-
to-point connection to GMCH.
If ITP700FLEX is Used: RESET#
connects from processor to GMCH
and then forks out to ITP700 FLEX,
with pull-up and series damping
resistor placed next to ITP.
Point-to-point connection to ICH4-M.
Point-to-point connection to ICH4-M.
Point-to-point connection to ICH4-M.
Point-to-point connection to ICH4-M,
with resistor placed by ICH4-M.
THERMTRIP# is a VCC signal. If
connecting to other device, voltage
translation logic may be required.
Please refer to Figure 109
®
852PM Chipset Platforms Design Guide
R
Notes