Infineon Technologies CYPRESS Traveo Series Manual page 21

Figure 4-7: TEQFP144 (0.4mm Pitch)
Package Type
TEQFP 144pin
0.20 C A-B D
2
DETAIL A
A
A1
11
e
Document Number: 002-10634 Rev. *J
Package Code
LEK144
4
D
5 7
D 1
E1
0.20 C A-B D
TOP VIEW
A
A'
b
0.08 C A-B D
SIDE VIEW
N OTES :
DIMENSION
SYMBOL
M IN. NOM. MAX.
1.70
A
0.15
0.05
A 1
18.00 BSC
D
16.00 BSC
D 1
5.80 REF
D 2
4.60 REF
D3
E 18.00 BSC
E 1 16.00 BSC
E 2 5.80 REF
E 3 4.60 REF
R 1 0.08
0.08 0.20
R 2
θ 0° 4° 8°
0.09 0.20
c
0.13 0.18 0.23
b
0.45 0.60 0.75
L
1.00 REF
L 1
0.25
L 2
e 0.40 BSC
E
L2
R1
GAUGE
θ PLANE
SEATING
PLANE R2
L
0.08 C
L1
DETAIL A
8
S6J3350 Series
D 2
D 3
E3 E2
EXPOSED PAD
BOTTOM VIEW
10
c
b
SECTION A-A'
002-11502 **
PACKAGE OUTLINE, 144 LEAD TEQFP
16.0X16.0X1.7 M M LEK144 REV**
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